Results 181 to 190 of about 18,262 (225)

Microfabrication in LiNbO3 by ion-bombardment-enhanced etching

Journal of Vacuum Science and Technology, 1978
Ion-bombardment-enhanced etching is suggested as an useful microfabrication technique for LiNbO3. Diluted HF was found to be a good selective etchant for a layer damaged by Ar+ and N+. This method is compared with another microfabrication method, ion beam etching. The accuracy of the pattern width by this method is better than that ion beam etching and
M. Kawabe, M. Kubota, K. Masuda, S. Namba   +3 more
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Microfabrication by ion-beam etching

Journal of Vacuum Science and Technology, 1979
The trend in the microelectronics industry, and in particular that part of the industry concerned with the fabrication of integrated circuits, is toward circuits with increasingly high density and devices with smaller feature size. This trend has spurred interest in several new process technologies for pattern replication.
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Microfabrication of crosslinked polytetrafluoroethylene using synchrotron radiation direct photo-etching

Applied Surface Science, 2002
Abstract High aspect-ratio (more than 10) microfabrication of crosslinked polytetrafluoroethylene (PTFE) has been carried out using synchrotron radiation (SR) direct photo-etching. The etching rates of crosslinked PTFE samples with various crosslinked densities were studied by changing photon fluence of SR at different sample temperatures.
T. Katoh, D. Yamaguchi, Y. Satoh, S. Ikeda, Y. Aoki, M. Washio, Y. Tabata   +6 more
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Direct writing for three-dimensional microfabrication using synchrotron radiation etching

Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308), 2001
This paper presents rapid three-dimensional microfabrication technologies for PTFE by direct writing with the TIEGA process, a LIGA-like process which replaces hard X-ray lithography with synchrotron radiation (SR) direct photo-etching. The etching rates of this process are of the order of 6-100 /spl mu/m/min, depending on the photon flux of the SR ...
Takanori Katoh, Nobuyoshi Nishi, Masafumi Fukagawa, Hiroshi Ueno, Susumu Sugiyama   +4 more
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Examination of Etching Agent and Etching Mechanism on Femotosecond Laser Microfabrication of Channels Inside Vitreous Silica Substrates

The Journal of Physical Chemistry C, 2009
We examined the physical chemistry underlying a wet chemical etching-assisted femtosecond laser microfabrication technique. Close scrutiny of etching reagents and the etching process has led to further refinement of the method for practical use such as microchips for chemical total analysis systems (μ-TAS).
Satoshi Kiyama, Shigeki Matsuo, Shuichi Hashimoto, Yasushi Morihira   +3 more
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Microfabrication of On-Demand Tapered Glass Capillaries by Etching Combined With Polishing

Journal of Microelectromechanical Systems, 2022
Chunyang Wei, Chengzhuang Yu, Shanshan Li, Jiyu Meng, Tiejun Li, Feng Pan, Zichao Wang, Junwei Li   +7 more
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Plasma-Assisted Etching in Microfabrication

Annual Review of Materials Science, 1983
It has long been recognized that a molecular gas glow discharge is a prolific source of chemically active radicals. However, it was not until the last twenty years or so that glow discharges were used to provide active radicals for the etching of solid materials.
J W Coburn, H F Winters
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Microfabrication Technique by Gas Plasma Etching Method

Japanese Journal of Applied Physics, 1975
The gas plasma etching technique is investigated as a tool of etching micro-patterns ranged from a few microns to submicrons mainly with polycrystalline silicon films as materials to be etched. The gas plasma etching is verified to be the "nearly ideal" chemical etching. The undercutting at the top of the polycrystalline silicon film is nearly equal to
H. KOMIYA, H. TOYODA, T. KATO, K. INABA
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Microfabrication of Poly(tetrafluoroethylene) Using SR Direct Etching

IEEJ Transactions on Electronics, Information and Systems, 2009
AbstractPolytetrafluoroethylene (PTFE) is a very attractive material for various fields because of its chemical resistance, insulation properties, and hydrophobic properties. However, it is difficult to fabricate PTFE microstructures with conventional techniques such as semiconductor processes or micromachining.
Shigeaki Yamamoto, Yoshiaki Ukita, Kozo Mochiji, Yuichi Utsumi   +3 more
openaire   +1 more source