Results 11 to 20 of about 2,685 (171)
Concealable physical unclonable functions using vertical NAND flash memory [PDF]
Physical Unclonable Functions (PUFs) can address the demand for enhanced hardware security. Vertical NAND (V-NAND) flash memory is the most commercialized non-volatile memory.
Sung-Ho Park +5 more
doaj +2 more sources
Gate-induced drain leakage (GIDL) current is investigated in single-gate (SG) ultra-thin body field effect transistor (FET), symmetrical double-gate (DG) FinFET, and asymmetrical DG metal oxide semiconductor field effect transistor (MOSFET) devices. Measured reductions in GIDL current for SG and DG thin-body devices are reported for the first time. The
Choi, YK Choi, Yang-Kyu +3 more
openaire +2 more sources
Self-Curable Synaptic Ferroelectric FET Arrays for Neuromorphic Convolutional Neural Network. [PDF]
The primary challenge that ferroelectric field‐effect transistors face is their vulnerability to the repeated program/erase cycle. To solve this issue, an efficient self‐curing method is presented. The proposed method successfully recovers synaptic fatigue damage, enhancing learning accuracy in the convolutional neural network.
Shin W +8 more
europepmc +2 more sources
Stacked Nanosheet Gate-All-Around Morphotropic Phase Boundary Field-Effect Transistors. [PDF]
This study proposes a material design using ferroelectric‐antiferroelectric mixed‐phase HZO to achieve steep subthreshold swing and non‐hysteretic on‐current enhancement in morphotropic phase boundary field‐effect transistors (MPB‐FETs). For the first time, two‐stacked nanosheet GAA MPB‐FETs with optimized HZO are demonstrated, validating superior ...
Kim S, Kim HM, Kwon KR, Kwon D.
europepmc +2 more sources
Advancing the Frontiers of HfO<sub>2</sub>-Based Ferroelectric Memories: Innovative Concepts from Materials to Applications. [PDF]
HfO2‐based ferroelectric materials are promising for next‐generation memory technologies by providing outstanding performance aligning with data‐centric computing needs. This review details recent advancements in materials, devices, and integration for HfO2‐based memories, with the goal of identifying both the technological opportunities and remaining ...
Zhou Z +9 more
europepmc +2 more sources
We have fabricated junctionless N-type silicon-on-insulator (SOI) ferroelectric-HfO2 field effect transistors (FeFETs) with overlap and underlap structures between gate and drain/source regions to investigate the role of gate-induced-drain-leakage (GIDL)
Fei Mo +8 more
doaj +1 more source
TCAD simulation using Silvaco software has shown that the 3G_DFM, which has SG1 (Select Gate 1), PL (Plate Line Gate), and SG2 (Select Gate 2) between SL (Source Line) and BL (Bit Line), has a long retention time of 100ms at 85 °C, and a robust ...
Koji Sakui +6 more
doaj +1 more source
Narrow Sub-Fin Technique for Suppressing Parasitic-Channel Effect in Stacked Nanosheet Transistors
A new approach of narrowing sub-fin with little extra process cost for suppressing parasitic-channel-effect (PCE) on vertically-stacked horizontal gate-all-around (GAA) Si nanosheet field-effect-transistors (NS-FETs) is proposed.
Jie Gu +11 more
doaj +1 more source
Emerging reconfigurable electronic devices based on two‐dimensional materials: A review
An intense survey of novel reconfigurable devices based on 2D materials is presented with a focus on reconfigurable transistors that offer run‐time control of charge carriers, threshold voltage, and subthreshold swing, and reconfigurable heterostructures manifested as multiple device configurations in one device. The working principles of these devices
Wenwen Fei +4 more
wiley +1 more source

