Results 151 to 160 of about 657,295 (208)
Some of the next articles are maybe not open access.

Related searches:

Analysis on the Difference of the Characteristic Between High Power IGBT Modules and Press Pack IGBTs

Microelectronics Reliability, 2017
Abstract The insulated gate bipolar transistor (IGBT) has been widely employed in such applications as alternate current motors and inverters for its lower driving power and lower on-state voltage. IGBT modules and press pack IGBTs are the most commonly used packaging for high-voltage and high-power-density applications.
Erping Deng   +2 more
exaly   +2 more sources

Multi-Chip IGBT Module Failure Monitoring Based on Module Transconductance With Temperature Calibration

open access: yesElectronics, 2020
The Insulated Gate Bipolar Transistor (IGBT) is the component with the highest failure rate in power converters, and its reliability is a critical issue in power electronics.
Chenyuan Wang, Xiaoxin Wu, Lie Li
exaly   +2 more sources

Heat Transfer of an IGBT Module Integrated With a Vapor Chamber

open access: yesJournal of Electronic Packaging, Transactions of the ASME, 2011
Presently, many methods are adopted to reduce the junction-to-case thermal resistance (Rjc) of insulated-gate bipolar transistor (IGBT) modules in order to increase their power density.
Xiaoling Yu, Quanke Feng
exaly   +2 more sources

Thermal characterization of IGBT power modules

Microelectronics Reliability, 1997
Abstract In this paper we report on experimental techniques for the thermal characterization of IGBT power modules. Three different systems have been used: the first one performs “in-time” characterization in order to control the most significant device parameters during normal operation or stress tests; the second one is for a complete and dynamic ...
COVA, Paolo   +4 more
openaire   +4 more sources

Chip Improvements for Future IGBT Modules

2008 IEEE Industry Applications Society Annual Meeting, 2008
Since the introduction of the IGBT module, improvements in power loss have been achieved by applying new technologies. With the process improvements of the past few years in trench gate technology and light-punch-through vertical structures, it had been thought that the performance of the latest IGBT and pin diode silicon power devices had been brought
John F. Donlon   +4 more
openaire   +1 more source

Analysis of an IGBT power module

Proceedings of IECON'94 - 20th Annual Conference of IEEE Industrial Electronics, 2002
The simulation of IGBT turn-on and turn-off phases is an important aspect of power converter design. Since power IGBTs have fast turn-on and turn-off time capabilities compared with SCRs and GTOs, the stray inductances of the circuit cause voltage spikes that can damage these devices.
A. Brambilla, E. Dallago, R. Romano
openaire   +1 more source

6.5 kV IGBT-modules

Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370), 2003
Power control in applications with a line voltage of 3 kV DC and more today is managed by GTOs and IGCTs. The IGBT, a device with several advantages compared to power semiconductors in thyristor structure (low requirements regarding the driving unit, easy cooling as a result of the isolated structure) is fully developed and introduced up to a blocking ...
F. Auerbach   +9 more
openaire   +1 more source

IGBT inverter with vector modulation

Proceedings of 1994 IEEE International Symposium on Industrial Electronics (ISIE'94), 2002
This work presents the design of a three-phase inverter with insulated gate bipolar transistors (IGBTs). The pulse width modulation technique based on the space vector theory is analysed in detail. The modulation strategy considers the calculation of the on-times of the different voltage vectors that must be applied to the load, to generate the voltage
J. Rodriguez   +4 more
openaire   +1 more source

Measurements of Parameters of the Thermal Model of the IGBT Module

IEEE Transactions on Instrumentation and Measurement, 2019
In this paper, the problem of how to describe the thermal properties of the insulated-gate bipolar transistor (IGBT) module with the use of the compact thermal model is considered. This model makes it possible to calculate internal temperature of every semiconductor device included in this module with self-heating phenomena and mutual thermal couplings
Krzysztof Górecki   +2 more
openaire   +1 more source

Home - About - Disclaimer - Privacy