Results 171 to 180 of about 11,950 (180)

Thermal Parameter Monitoring of IGBT Module Using Case Temperature

IEEE Transactions on Power Electronics, 2019
Jun Zhang, Xiong Du, Yu Wu
exaly  

Impact of thermal interface material on power cycling lifetime of IGBT module

Microelectronics Reliability, 2021
exaly  

Measurements of Parameters of the Thermal Model of the IGBT Module

IEEE Transactions on Instrumentation and Measurement, 2019
Krzysztof Górecki, Paweł Górecki, Janusz Zarębski   +2 more
exaly  

Optimized selection of materials for IGBT module packaging

Microelectronics Reliability, 2022
exaly  

Multi-physics coupling analysis of high-power IGBT module bonding wires fault considering stray inductance of main circuit

Microelectronics Reliability, 2023
exaly  

Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop

Microelectronics Reliability, 2018
Minyou Chen, Bing Gao, Wei Lai
exaly  

Junction temperature management of IGBT module in power electronic converters

Microelectronics Reliability, 2014
Pengju Sun
exaly  

The effect of electro-thermal parameters on IGBT junction temperature with the aging of module

Microelectronics Reliability, 2016
exaly  

Condition Monitoring the Inhomogeneous Thermal Fatigue of Multichip IGBT Module Based on the Thermal Attenuation Coefficient

IEEE Transactions on Power Electronics
Xiong Du
exaly  

Study of Bonding Wire Failure Effects on External Measurable Signals of IGBT Module

IEEE Transactions on Device and Materials Reliability, 2014
exaly