Results 41 to 50 of about 11,875 (232)

Multiterminal High‐Voltage Direct Current Projects: A Comprehensive Assessment and Future Prospects

open access: yesHigh Voltage, EarlyView.
ABSTRACT Multiterminal high‐voltage direct current (MT‐HVDC) systems are an important part of modern power systems, addressing the need for bulk power delivery and efficient renewable energy integration. This paper provides a comprehensive overview of recent advances in MT‐HVDC technology, including launched projects and ongoing initiatives.
Mohammad Hossein Mousavi   +3 more
wiley   +1 more source

Stochastic RUL calculation enhanced with TDNN-based IGBT failure modeling [PDF]

open access: yes, 2016
Power electronics are widely used in the transport and energy sectors. Hence, the reliability of these power electronic components is critical to reducing the maintenance cost of these assets.
Alghassi, Alireza   +2 more
core   +1 more source

The Diverse Behaviours of Discharged Degradation at Varied Interfaces of Silicone Gel/Ceramic Substrates Under High‐Frequency Square Wave Voltage

open access: yesHigh Voltage, EarlyView.
ABSTRACT Because of the harsh serving conditions of insulated gate bipolar transistor (IGBT) packaged by silicone gel with high voltage and high frequency, it is crucial to reveal the developing characteristics and inhibiting method of discharged degradation at the interface of silicone gel/ceramic substrates.
Chuang Zhang   +7 more
wiley   +1 more source

Self-Commissioning of Inverter Nonlinear Effects in AC Drives [PDF]

open access: yes, 2012
The paper presents a novel technique for an accurate identification of the inverter nonlinear effects, such as the dead-time and on-state voltage drops. The proposed technique is very simple and it is based only on a current control scheme.
Armando, Eric Giacomo   +3 more
core   +1 more source

Series Connection of LCC and Full Bridge MMC With DC Fault Ride‐Through Capability for Lightweight HVDC Transmission

open access: yesEngineering Reports, Volume 8, Issue 4, April 2026.
In this work, we investigate a lightweight HVDC converter topology that combines the strengths of line‐commutated converters (LCC) and full‐bridge modular multilevel converters (MMC) to address the high cost and large footprint of conventional HVDC stations.
Yang Wang   +7 more
wiley   +1 more source

Research on IGBT Bonding Wires Crack Propagation at the Macro and Micro Scales

open access: yesIEEE Access, 2021
Under the action of a complex and harsh working environment, the damage of the IGBT power module’s packaging interconnection structure is the primary failure mode.
Jun Luo   +4 more
doaj   +1 more source

Thermal coupling analysis for a multi-chip paralleled IGBT module in a doubly fed wind turbine power converter [PDF]

open access: yes, 2017
Thermal coupling between adjacent IGBT or diode chips is the result of non-uniform temperature distribution in a multi-chip IGBT module. This affects the junction temperatures and hence the total power loss predicted for the module.
Hu, Yaogang   +6 more
core   +1 more source

Weibull‐Neural Network Framework for Wind Turbine Lifetime Monitoring and Disturbance Identification

open access: yesWind Energy, Volume 29, Issue 4, April 2026.
ABSTRACT Wind turbines are vital for sustainable energy, yet their reliability under diverse operational and environmental conditions remains a challenge, often leading to costly failures. This study presents a novel Weibull‐Neural Network Framework to enhance wind turbine lifetime monitoring by estimating reliability (R(t)) and mean residual life (MRL)
Fatemeh Kiadaliry   +2 more
wiley   +1 more source

Multistage Zeeman deceleration of metastable neon

open access: yes, 2011
A supersonic beam of metastable neon atoms has been decelerated by exploiting the interaction between the magnetic moment of the atoms and time-dependent inhomogeneous magnetic fields in a multistage Zeeman decelerator.
Agner, Josef A.   +7 more
core   +1 more source

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics

open access: yesAdvanced Science, Volume 13, Issue 17, 23 March 2026.
This review surveys emerging materials for thermal management in advanced electronic packaging, with emphasis on ceramic substrates and thermal interface materials. Multiscale simulations and mechanistic analyses are highlighted, alongside the emerging role of artificial intelligence in predicting thermal properties and guiding design, offering ...
Yongjun Huo   +11 more
wiley   +1 more source

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