Results 31 to 40 of about 103,218 (331)

Effect of electropulsing on the solidification of mould flux

open access: yesJournal of Materials Research and Technology, 2022
The effect of electropulsing on the microstructure formation in solidification of mould flux has been investigated. Experimental characterization and image analysis reveals that the electropulsing treatment reduces 46% porosity and increases the ...
Ashutosh G. Bhagurkar, Rongshan Qin
doaj   +1 more source

Solidification behavior and microstructural evolution of near-eutectic Zn-Al alloys under intensive shear [PDF]

open access: yes, 2008
Copyright @ 2009 ASM International. This paper was published in Metallurgical and Materials Transactions A, 40(1), 185 - 195 and is made available as an electronic reprint with the permission of ASM International.
Fan, Z, Ji, S
core   +2 more sources

Microstructure and mechanical properties of SiO2-BN ceramic and Invar alloy joints brazed with Ag–Cu–Ti+TiH2+BN composite filler

open access: yesJournal of Materiomics, 2016
Ag–Cu–Ti + TiH2+BN composite filler was prepared to braze SiO2-BN ceramic and Invar alloy. The interfacial microstructure, mechanical properties, and residual stress distribution of the brazed joints were investigated.
Y. Wang   +4 more
doaj   +1 more source

Interfacial adhesion of laser clad functionally graded materials [PDF]

open access: yes, 2003
Specially designed samples of laser clad AlSi40 functionally graded materials (FGM) are made for evaluating the interfacial adhesion. To obtain the interfacial bond strength notches are made right at the interface of the FGMs.
Dahotre, NB   +6 more
core   +3 more sources

Study of corrosion mechanism of cast iron in molten aluminum

open access: yesMaterials Research Express, 2020
The corrosion mechanism of three aluminum ingot mold materials used by Chinese aluminum electrolytic enterprises in molten aluminum was studied: The three materials are pearlite cast iron(PCI) contains vermicular graphite, lamellar graphite, and ...
Qiyu Wang   +3 more
doaj   +1 more source

Application Progress of PALS in the Correlation of Structure and Properties for Graphene/Polymer Nanocomposites

open access: yesNanomaterials, 2022
Giving a deep insight into the microstructure, and realizing the correlation between microstructure and properties is very important to the precise construction of high-performance graphene/polymer nanocomposites (GPN).
Xiaobing Han   +5 more
doaj   +1 more source

Microstructure, shear properties and corrosion resistance of Cu/Cu-In/Cu solder joints

open access: yesJournal of Advanced Joining Processes, 2022
Transient liquid phase sintering can successfully fabricate reliable high-temperature solder joints at a relatively low joining temperature by forming intermetallic compounds.
Li Liu   +7 more
doaj   +1 more source

Microstructural Evolution Based on Fundamental Interfacial Properties [PDF]

open access: yes, 2003
This first CMSN project has been operating since the summer of 1999. The main achievement of the project was to bring together a community of materials scientists, physicists and mathematicians who share a common interest in the properties of interfaces and the impact of those properties on microstructural evolution.
Rollett, A. D.   +2 more
openaire   +2 more sources

Mechanisms of High Temperature Degradation of Thermal Barrier Coatings. [PDF]

open access: yes, 2009
Thermal barrier coatings (TBCs) are crucial for increasing the turbine inlet temperature (and hence efficiency) of gas turbine engines. The thesis describes PhD research aimed at improving understanding of the thermal cycling failure mechanisms of ...
Wu, Rudder T.C., Wu, Rudder T.C.
core   +1 more source

Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

open access: yesResults in Physics, 2018
In this study, SAC305 and SAC305-0.3Ni solder balls were soldered onto Cu, high temperature treated Cu (H-Cu) and graphene coated Cu (G-Cu) substrates, respectively. The microstructure, the interfacial reaction, and the hardness of the solder joints were
Shengli Li   +5 more
doaj   +1 more source

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