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Wet isotropic chemical etching of Pyrex glass with masking layers Cr/Au [PDF]
In this paper we developed various techniques of wet isotropic chemical etching of Pyrex glass in an aqueous solution of 49% HF. The techniques are based on the processes of sputtering and photolithography. The various thin films of Cr/Au were sputtered.
Mladenović, Ivana +6 more
core +5 more sources
A Scalable Double-Sided Wet Etching Strategy for Large-Area Mushroom-Shaped Bionic Adhesives. [PDF]
This work presents a scalable manufacturing strategy for high‐performance, large‐area, mushroom‐shaped bio‐inspired adhesives. Using a double‐sided wet etching process, the complex 3D metal molds are fabricated rapidly and controllably. The resulting adhesive structures exhibit strong, stable adhesion under various conditions, including atmosphere and ...
Ji K +8 more
europepmc +2 more sources
Anisotropic etching of graphite and graphene in a remote hydrogen plasma
Nanofabrication: remote etching of graphene on hBN is highly anisotropic Etching of graphite with hydrogen plasma gives rise to two distinct etching regimes, governed by the degree of direct plasma exposure. A team led by D. M.
D. Hug +8 more
doaj +1 more source
Gate-all-around (GAA) field-effect transistors have been proposed as one of the most important developments for CMOS logic devices at the 3 nm technology node and beyond.
Yangyang Li +17 more
doaj +1 more source
A template-free, more environmentally friendly approach for glass micro-texturing
Micron and nanometer size textured silicate glass surfaces are of interest in consumer electronics, photovoltaics, and biosensing applications. Typically, texturing glass surfaces requires applying a patterned mask or a pre-etching treatment (e.g ...
Yuhui Jin +7 more
doaj +1 more source
Isotropic plasma atomic layer etching of Al2O3
Data used to plot all of the figures in the letter titled "Isotropic plasma atomic layer etching of Al2O3 using a fluorine containing plasma and Al(CH3)3)".
Chittock, Nicholas J. +2 more
core +1 more source
Selective etching of silicon nitride over silicon oxide using ClF3/H2 remote plasma
Precise and selective removal of silicon nitride (SiNx) over silicon oxide (SiOy) in a oxide/nitride stack is crucial for a current three dimensional NOT-AND type flash memory fabrication process.
Won Oh Lee +11 more
doaj +1 more source
Comparison between Bosch and STiGer Processes for Deep Silicon Etching
The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer, was developed in 2006 and patented.
Thomas Tillocher +5 more
doaj +1 more source
Passivation of a Conductive System of Integrated Circuits with a Layer of Aluminum Nitride
Passivation of the film conductive system of integrated circuits makes it more reliable by increasing the resistance to electromigration. The problem of manufacturing a passivating layer on the formed current-conducting system of an integrated circuit ...
V. V. Emelyanov
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To improve the advanced manufacturing technology for functional materials, a sophisticated control of chemical etching process is highly demanded, especially in the fields of environment and energy related applications. In this study, a phase-field-based
Kun-Dar Li, Jin-Ru Miao
doaj +1 more source

