Results 181 to 190 of about 23,650 (265)

Theory and Design Methodology for Reverse-Modulated Dual-Branch Power Amplifiers Applied to a 4G/5G Broadband GaN MMIC PA Design

IEEE transactions on microwave theory and techniques, 2021
This article presents a generalized theory and new design methodology for reverse-load-modulated dual-branch (RMDB) power amplifiers (PAs), which uses a current-biased transistor in the main branch to realize optimal load modulation without using the ...
Yulong Zhao, Xiang Li, C. Gai, Chang Liu, Tian Qi, Biao Hu, Xin Hu, Wen-hua Chen, M. Helaoui, F. Ghannouchi   +9 more
semanticscholar   +1 more source

Analytical Design of Millimeter-Wave 100-nm GaN-on-Si MMIC Switches Using FET-Based Resonators and Coupling Matrix Method

IEEE transactions on microwave theory and techniques, 2021
This article presents an analytical design for millimeter-wave monolithic microwave integrated circuit (MMIC) switches. First, the field-effect-transistor-based (FET-based) resonator is proposed, whose resonant frequency and bandwidth can be controlled ...
Guangxu Shen, W. Che, Haoshen Zhu, Feng Xu, Q. Xue   +4 more
semanticscholar   +1 more source

MMIC transmission lines for multi-layered MMICs

1991 IEEE MTT-S International Microwave Symposium Digest, 2002
Multilayered MMIC (monolithic microwave integrated circuit) transmission line configurations are proposed, and their performance is experimentally investigated. Four transmission line structures have been fabricated using polyimide films: (1) microstrip line with overlay, (2) inverted microstrip line, (3) trapezoid microstrip line, and (4) valley ...
H. Ogawa, T. Hasegawa, S. Banba, H. Nakamoto   +3 more
openaire   +1 more source

Uniplanar MMIC Hybrids--A Proposed New MMIC Structure

IEEE Transactions on Microwave Theory and Techniques, 1987
A new "uniplanar" circuit configuration for monolithic microwave integrated circuits (MMIC's) has been proposed. It uses a combination of coplanar waveguides and slotlines on one side of the substrate. The key components for the uniplanar structure are air bridges, which provide T junctions and transitions from coplanar waveguides to slotlines or vice ...
T. Hirota, Y. Tarusawa, H. Ogawa
openaire   +1 more source

A Compact Ultra-broadband GaN MMIC T/R Front-End Module

Intelligent Memory Systems, 2020
This paper presents the design and the measured results of a monolithic microwave integrated circuit (MMIC) T/R front-end module (FEM) suitable for S band to Ku band applications, using a 0.1µm GaN HEMT process.
Q. Lin, Hai-feng Wu, Yijun Chen, Liu-lin Hu, Shanji Chen, Xiao-Ming Zhang   +5 more
semanticscholar   +1 more source

C–Ku-Band RF-Input Load Modulated Balanced Amplifier MMIC Utilizing Broadband Saturation Efficiency Enhancement Technique

IEEE transactions on microwave theory and techniques
This article presents a C-Ku-Band 10 W RF-input load-modulated balanced amplifier (LMBA) monolithic microwave integrated circuit (MMIC) with enhanced power added efficiency (PAE) at saturation.
Li Kang, Aimin Wu, Wenhua Chen, Xiaofan Chen   +3 more
semanticscholar   +1 more source

An Efficient Transistor-Model-Assisted Layout Synthesis Approach Using Improved Implicit Space Mapping for High-Performance MMIC PAs

IEEE Transactions on Circuits and Systems - II - Express Briefs
In this brief, a novel design approach for monolithic microwave integrated circuit (MMIC) power amplifiers (PAs) using improved implicit space mapping (IISM) and transistor modeling is proposed.
Jingyuan Zhang, Xu Yan, Haorui Luo, Yongxin Guo   +3 more
semanticscholar   +1 more source

Interconnects And Packaging For MMIC's

27th European Microwave Conference and Exhibition, 1997
This contribution reviews a number of aspects relevant for interconnects and packaging of monolithic integrated millimeter-wave circuits, possibly combined with hybrid or even waveguide circuits. Topics are packaging and front-end architecture, package materials, and standard interconnects to microstrip or coplanar MIMIC's.
openaire   +1 more source

Near-Junction Thermal Management of GaN-on-SiC MMIC Power Amplifier Through Substrate Embedded Microchannel

IEEE Transactions on Electron Devices
Self-heating inhibits the electrical characteristics improvement of GaN devices. The local hotspots generated in the gate region significantly affect the output performance of GaN devices.
Dichen Lu, Yuxin Ye, Ruiwen Liu, Mei Wu, Xiangbin Du, Lihang Yu, Jingping Qiao, Ziyu Liu, Yanmei Kong, Binbin Jiao, Xiao-hua Ma, Y. Hao   +11 more
semanticscholar   +1 more source

Three-dimensional MMIC technology and application to millimeter-wave MMICs

1997 Topical Symposium on Millimeter Waves. Proceedings (Cat. No.97TH8274), 2002
Three-dimensional MMIC is a significantly promising technology for accurate and easy design and low-cost fabrication of millimeter-wave MMICs. Passive circuit components and amplifiers in the 50 and 60-GHz bands are demonstrated.
T. Tokumitsu, K. Nishikawa, K. Karnogawa, I. Toyoda, K. Nishimura   +4 more
openaire   +1 more source