Results 211 to 220 of about 157,312 (300)
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A hybrid III–V tunnel FET and MOSFET technology platform integrated on silicon
Nature Electronics, 2021Clarissa Convertino +2 more
exaly +2 more sources
FinFET-a self-aligned double-gate MOSFET scalable to 20 nm
IEEE Transactions on Electron Devices, 2000Chenming Hu
exaly +2 more sources
IEEE transactions on power electronics, 2021
Featuring higher switching speed and lower losses, the silicon carbide MOSFETs (SiC MOSFETs) are widely used in higher power density and higher efficiency power electronic applications as a new solution.
Yang Wen, Yuan Yang, Yong Gao
semanticscholar +1 more source
Featuring higher switching speed and lower losses, the silicon carbide MOSFETs (SiC MOSFETs) are widely used in higher power density and higher efficiency power electronic applications as a new solution.
Yang Wen, Yuan Yang, Yong Gao
semanticscholar +1 more source
Online Junction Temperature Measurement for SiC MOSFET Based on Dynamic Threshold Voltage Extraction
IEEE transactions on power electronics, 2021The online junction temperature monitoring of power devices is a viable technique to ensure the reliable operation of mission-critical power electronic converters.
Xi Jiang +6 more
semanticscholar +1 more source
A review on performance comparison of advanced MOSFET structures below 45 nm technology node
Journal of Semiconductors, 2020CMOS technology is one of the most frequently used technologies in the semiconductor industry as it can be successfully integrated with ICs. Every two years the number of MOS transistors doubles because the size of the MOSFET is reduced.
Namrata Mendiratta, S. Tripathi
semanticscholar +1 more source
2020
Modern switching components for energy processing widely consist of active semiconductor devices in Si, a mature and well-established technology that is reaching its physical limits. The main limitations of Si concern the blocking voltage capability, the switching frequency, and the operating temperature.
Maresca L. +7 more
openaire +2 more sources
Modern switching components for energy processing widely consist of active semiconductor devices in Si, a mature and well-established technology that is reaching its physical limits. The main limitations of Si concern the blocking voltage capability, the switching frequency, and the operating temperature.
Maresca L. +7 more
openaire +2 more sources
A SiC MOSFET and Si IGBT Hybrid Modular Multilevel Converter With Specialized Modulation Scheme
IEEE transactions on power electronics, 2020The utilization of silicon carbide (SiC) MOSFET instead of silicon (Si) IGBT can significantly improve the performance of many converters. However, a modular multilevel converter (MMC) completely based on the SiC MOSFET suffers from high cost and high ...
Tianxiang Yin +3 more
semanticscholar +1 more source
IEEE transactions on power electronics, 2019
In this paper, a hybrid switch (HyS) consisting of a large current rated Si insulated-gate bipolar transistor (IGBT) device connected in parallel with a small current rated SiC MOSFET device (low SiC/Si current ratio below unity) is proposed for high ...
A. Deshpande, F. Luo
semanticscholar +1 more source
In this paper, a hybrid switch (HyS) consisting of a large current rated Si insulated-gate bipolar transistor (IGBT) device connected in parallel with a small current rated SiC MOSFET device (low SiC/Si current ratio below unity) is proposed for high ...
A. Deshpande, F. Luo
semanticscholar +1 more source
A Novel Active Gate Driver for Improving Switching Performance of High-Power SiC MOSFET Modules
IEEE transactions on power electronics, 2019Featuring higher switching speed and lower losses, the silicon carbide mosfets (SiC mosfets) are widely used in higher power density and higher efficiency power electronic applications as a new solution.
Yuan Yang, Yang Wen, Yong Gao
semanticscholar +1 more source
Japanese Journal of Applied Physics, 2019
We present a vertical GaN planar metal-oxide-semiconductor field-effect transistor (MOSFET) fabricated by an all ion implantation process. The fabricated MOSFET shows an on-resistance of 2.78 mΩ cm2 and a breakdown voltage of 1200 V, by applying the ...
R. Tanaka +4 more
semanticscholar +1 more source
We present a vertical GaN planar metal-oxide-semiconductor field-effect transistor (MOSFET) fabricated by an all ion implantation process. The fabricated MOSFET shows an on-resistance of 2.78 mΩ cm2 and a breakdown voltage of 1200 V, by applying the ...
R. Tanaka +4 more
semanticscholar +1 more source

