Results 261 to 270 of about 80,998 (291)
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High temperature instabilities of ohmic contacts on p‐GaN
physica status solidi c, 2008AbstractThis paper describes an investigation of the instabilities of ohmic contacts on p‐type GaN submitted to long term high temperature stress. Transfer Length Method (TLM) was used to separately analyze the contribution of contact resistivity and sheet resistance on contact degradation. Before treatment, contacts showed linear behaviour, indicating
TREVISANELLO, LORENZO ROBERTO +5 more
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Ultralow-Ohmic-contact resistance of Ni/Ag/NiO on p++-GaN/p-GaN/AlGaN/GaN platform
Applied Physics LettersA record-low Ohmic contact resistance is obtained on p++-GaN/p-GaN/GaN/AlGaN/GaN epitaxial structure designed for GaN CMOS circuit. Ni/Ag/NiO (1/120/6 nm) after 500 °C/360 s annealing in air atmosphere demonstrates an ultralow contact resistance (1.67 Ω mm) and the lowest specific contact resistivity (6.48 × 10–7 Ω cm2) reported so far.
Zhiwei Sun +13 more
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IEEE Transactions on Electron Devices, 2016
This paper reports on the behavior of Al/Ti/p-GaN interfaces as gate contacts for p-GaN/AlGaN/GaN normally off high electron mobility transistor (HEMTs), highlighting the impact of the thermal budget on the metal gate on the device characteristics. In fact, while the devices subjected to an annealing at 800 degrees C show a considerable high leakage ...
G Greco +5 more
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This paper reports on the behavior of Al/Ti/p-GaN interfaces as gate contacts for p-GaN/AlGaN/GaN normally off high electron mobility transistor (HEMTs), highlighting the impact of the thermal budget on the metal gate on the device characteristics. In fact, while the devices subjected to an annealing at 800 degrees C show a considerable high leakage ...
G Greco +5 more
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A Schottky gate p-GaN fin-channel field effect transistor on very low doped p-GaN films
Japanese Journal of Applied PhysicsAbstract In this paper, we report a trigate fin-channel field effect transistor (FET) on very low doped p-GaN films. While achieving a good source/drain ohmic contact mandates a high p-GaN doping; a good Schottky gate interface contrarily demands a low doping.
Manuel Fregolent +11 more
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Large Schottky barriers for Ni/p-GaN contacts
Applied Physics Letters, 1999Large Schottky barriers were measured for Ni contacts formed on low Mg-doped p-GaN. In order to improve leaky Schottky characteristics, low-Mg doping was examined. This provided atomically flat surfaces and a low dislocation density of 5.5×108 cm−2. The Schottky barrier height (qφB) as high as 2.4±0.2 eV and n values of 1.84±0.06 were obtained from ...
Kenji Shiojima +2 more
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Reverse Blocking p-GaN Gate HEMTs With Multicolumn p-GaN/Schottky Alternate-Island Drain
IEEE Electron Device Letters, 2022Ruize Sun +10 more
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Low applied bias for p-GaN electroluminescent devices
Microelectronic Engineering, 2005Nickel ohmic contacts and Schottky contacts using silver or titanium were fabricated on Mg-doped p-GaN films. The light emission has been obtained from these thin film electroluminescent devices (ELDs). These ELDs were operated under direct current (DC) bias.
F.K. Yam +4 more
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2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2022
Ruize Sun +7 more
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Ruize Sun +7 more
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Charge Control in Schottky-Type p-GaN Gate HEMTs With Partially and Fully Depleted p-GaN Conditions
IEEE Transactions on Electron Devices, 2022Qianshu Wu +11 more
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