Results 201 to 210 of about 1,418,757 (266)

Own and others' confidence in social information use. [PDF]

iScience
Gradassi A, van den Bos W, Molleman L.
europepmc   +1 more source

Exploration of m7G-related immune genes and construction of a prognostic risk model in gastric cancer. [PDF]

Sci Rep
Li N, Yin J, Zhao Y, Fan Y, Wei J, Gao Z, Zhang R.   +6 more
europepmc   +1 more source

Variability in first academic medicine job offers in pulmonary and critical care medicine. [PDF]

ATS Sch
Olson EM, Modes ME, Rowe TJ, Lyons PG, Ingraham NE, Nadig NR, Schroedl CJ, Gao CA.   +7 more
europepmc   +1 more source

Defining person-centred treatment support for multidrug-resistant TB: a discrete choice experiment. [PDF]

IJTLD Open
Kagujje M, Mtumbi G, Sikandangwa M, Shatalimi J, Muyoyeta M, Kerkhoff AD.   +5 more
europepmc   +1 more source

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A study of package warpage for package on package (PoP)

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010
Package warpage is a primary concern in a package-on-package. To enhance the accuracy of modeling prediction, viscoelastic parameters, the change of material properties after injection mold cure (IMC) and post mold cure (PMC) temperature and it's time, and cure shrinkage were studied with a dynamic modulus analysis (DMA) and a thermal mechanical ...
Masazumi Amagai, Yutaka Suzuki
openaire   +1 more source

Signal Integrity Flow for System-in-Package and Package-on-Package Devices

Proceedings of the IEEE, 2009
As data rates required for systems in package (SiPs) increase and their complexity increases, signal integrity issues become increasingly difficult to address. The design flow of the SiP should therefore take into account these issues from the beginning.
Paolo Pulici, Gian Pietro Vanalli, Michele A. Dellutri, Domenico Guarnaccia, Filippo Lo Iacono, Giovanni Campardo, Giancarlo Ripamonti   +6 more
openaire   +2 more sources

The development of a novel stacked package: package in package

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585), 2004
Stacked die chip scale packages (CSPs) or fine-pitch BGAs (FBGAs) have been readily adopted and integrated in many handheld products, most notably cellular phones. Such stacked die CSPs are especially useful to reduce the cost, weight, and size of the memory devices needed to support the increased features and applications in cellular phones today.
F. Carson, null Young-Cheol Kim
openaire   +1 more source