Results 211 to 220 of about 1,418,757 (266)
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Journal of Management in Engineering, 1994
Supplementary benefit packages and the level of support management gives the package varies widely from firm to firm. On average, consulting and design firms spend approximately 28.75% of gross annual payroll on benefits (excluding federally‐mandated contributions, which account for an additional 10–12%).
Michael W. Creed +2 more
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Supplementary benefit packages and the level of support management gives the package varies widely from firm to firm. On average, consulting and design firms spend approximately 28.75% of gross annual payroll on benefits (excluding federally‐mandated contributions, which account for an additional 10–12%).
Michael W. Creed +2 more
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On-package decoupling optimization with package macromodels
Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003., 2004Suppressing clock-gating-induced noise at the chip-package interface is one of the most challenging power distribution integrity issues. In this paper, accurate and efficient assessment of the effectiveness of on-package decoupling is facilitated by package macromodels which compactly represent packaging parasitics among multiple on-package decoupling ...
Hui Zheng +2 more
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A Study on Package Stacking Process for Package-on-Package (PoP)
56th Electronic Components and Technology Conference 2006, 2006This paper outlines package stacking process guidelines for a package-on-package (PoP) configuration. PoP stacks currently in production or development consist of a bottom package containing a high performance logic device designed to receive a mating top package typically containing high capacity or combination memory devices.
A. Yoshida +7 more
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International Symposium on Microelectronics, 2012
Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages, especially when coupled with the use of stacked die. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and ...
Rabindra N. Das +5 more
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Package on Package (PoP) stacking has become an attractive method for 3D integration to meet the demands of higher functionality in ever smaller packages, especially when coupled with the use of stacked die. To accomplish this, new packaging designs need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and ...
Rabindra N. Das +5 more
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Avoiding packaging mismatch with flexible packaging
Proceedings of the 21st international conference on Software engineering, 1999To integrate a software component into a system, it must interact properly with the system's other components.
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Plastic Packaging Wrap for Patient Packaging
Journal of Special Operations MedicineBandages have been used in hemorrhage control since at least ancient Egyptian, Greek, and Roman times. The design remained unchanged until the fifth century BCE, when gauze was introduced. Modern bandages are relatively expensive and heavy and are not widely available in low-resource environments. Packaging wrap, sometimes called Saran wrap, cling film,
Patrick, Thompson +2 more
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Chip package interaction for LED packages
Microelectronics Reliability, 2016Abstract Solid-state lightings (SSL) rapidly penetrate the global illumination market because of the energy efficiency and the reliability. The energy efficiency can be easily evaluated but the reliability is not convenient to be estimated. Among several reliability issues, a LED chip level's reliability could be a difficult problem because chip ...
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When the Best Packaging Is No Packaging
International Commerce Review, 2010At first glance, recycling waste packaging seems ‘green’. However, it’s a costly business, requiring a large amount of CO2-intensive transportation and processing. Instead, why not simply eliminate the packaging? An Italian experiment shows this approach can have many benefits.
Chieko Minami +2 more
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Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package
IEEE Design & Test, 2015In this work, the thermal analysis is performed to investigate and improve the heat dissipation capability of the fan-out eWLP POP structure. The simulation scheme was validated with the available experimental results conducted previously by Hoe et al. [9]. The 3-D package studied is shown in Figure 1.
Yong Han +3 more
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