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Impact of NBTI/ HCI /PBTI ON 6T SRAM reliability

2020 Fourth World Conference on Smart Trends in Systems, Security and Sustainability (WorldS4), 2020
The main focus of this article is the reliability and aging of the 6T (SRAM) Static random access memories. From many days of the SRAM circuit have been used, so consider its reliability and aging factor. In this paper reliability and aging are performed under the parameters of (HCI), (NBTI) and (PBTI).
Vartika Pandey   +2 more
openaire   +1 more source

On-chip circuit to monitor long-term NBTI and PBTI degradation

Microelectronics Reliability, 2013
Abstract A circuit for on-chip monitoring bias-temperature instability (BTI) degradation of CMOS devices, which distinguishes between NBTI and PBTI, is described. Intended for long-term monitoring of field-installed systems, the measurements are performed entirely on chip, and reported through digital scan chains.
Keith A. Jenkins, Pong-Fei Lu
openaire   +1 more source

Investigation of The NBTI and PBTI Effects on Multiplexer Circuit Performances

2020 IEEE International Conference on Semiconductor Electronics (ICSE), 2020
This paper investigates the effects of Negative Bias Temperature Instability (NBTI) & Positive Bias Temperature Instability (PBTI) on 2-to-1 multiplexer circuit performances. The key objective of this research is to analyse the effects of NBTI and PBTI on the delay and average power of 2-to-1 multiplexer circuit.
M. S. S. Mohamad Saofi   +3 more
openaire   +1 more source

Concurrent PBTI and hot carrier degradation in n-channel MuGFETs

Microelectronics Reliability, 2011
Abstract The experimental investigations on the concurrent PBTI and CHC degradation in n-channel MuGFETs have been performed with different stress gate voltages, gate lengths, fin widths, and side surface orientations of fin body. The observed results suggest that the enhanced hot carrier degradation at elevated temperature is due to the interaction ...
Seung Min Lee   +3 more
openaire   +1 more source

Process-Dependent N/PBTI Characteristics of TiN Gate FinFETs

IEEE Electron Device Letters, 2012
A study of the negative and positive bias temperature instability (N/PBTI) reliability of FinFETs with different TiN metal gates deposited by either atomic layer deposition (ALD) or physical vapor deposition (PVD) on HfO2 dielectrics found that the nonuniformity of the interfacial oxide layer is closely related to reliability characteristics.
Young Gon Lee   +2 more
exaly   +2 more sources

On the PBTI degradation of pMOSFETs and its impact on IC lifetime

2011 IEEE International Integrated Reliability Workshop Final Report, 2011
Negative Bias Temperature Instability (NBTI) of pMOSFETs is nowadays the most prominent device degradation mechanism reported in the literature and a limiting factor for CMOS technology scaling. In contrast, for Positive Bias Temperature Instability (PBTI) of pMOSFET only very few publications can be found [1–4].
Christian Schlunder   +3 more
openaire   +1 more source

Reliability Analysis of Comparator: NBTI, PBTI, HCI, AGEING

2018
In this research, we focus on analytical reliability assessment. The reliability of meticulous conditions of voltage, temperature and degradation will be reported to device bounds. Such as the same effect on analogue or digital device performance like Comparator cell and combined circuits.
Seelam V. Sai Viswanada Prabhu Deva Kumar   +1 more
openaire   +1 more source

Impact of gate poly doping and oxide thickness on the N- and PBTI in MOSFETs

Microelectronics Reliability, 2011
Abstract We study n- and pMOS devices with 3.2–30 nm thick SiON or SiO2 gate dielectrics and n++ or p++ doped polysilicon gates to identify the type and energetic location of defects created through bias temperature stress. The results clearly indicate a dependence of the type of BTS induced defects on the stress polarity and the gate poly doping. If
Gregor Pobegen   +3 more
openaire   +1 more source

Aging-aware timing analysis considering combined effects of NBTI and PBTI

International Symposium on Quality Electronic Design (ISQED), 2013
Transistor aging due to Bias Temperature Instability (BTI) and Hot Carrier Injection (HCI) is one of the major reliability issues of VLSI circuits fabricated at nanometer technology nodes. Transistor aging increases the circuit delay over the time and ultimately leads to lifetime reduction of VLSI chips.
Kiamehr, S., Firouzi, F., Tahoori, M. B.
openaire   +3 more sources

Investigating the impact of the defect dynamic characteristics on the PBTI in the high-κ gate device

Microelectronics Reliability, 2018
Abstract Recent device reliability studies on the metal/high-κ device observed the inter-convertible characteristics of the electron trap levels between the shallow and deep defect states under cyclic positive-bias temperature stressing. Although the oxygen vacancy and oxygen interstitial defect, being two typical types of defects in the high-κ oxide,
Xianqiang Liu   +6 more
openaire   +2 more sources

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