Results 141 to 150 of about 86,621 (303)

Leaftronics: Bio‐Fractal Scaffolds From Leaf Venation for Low‐Waste Electronics

Advanced Materials, EarlyView.
“Leaftronics” transforms naturally evolved leaf venation into quasi‐fractal scaffolds for sustainable electronics. Polymer‐infiltrated leaf skeletons can be used to fabricate ultra‐smooth, reflow‐ and thin‐film‐compatible decomposable substrates, while making the same lignocellulose networks conducting results in flexible transparent electrodes.
Rakesh Rajendran Nair, Hrisheekesh Thachoth Chandran, Karl Leo, Hans Kleemann   +3 more
wiley   +1 more source

Laser‐Assisted Phase Engineering of 2D MoS2 for Efficient Solution‐Processed Electronics

Advanced Materials, EarlyView.
Here, local laser‐assisted phase transition from solution‐processed phase‐pure 1T′ to 2H MoS2 is shown to critically depend on the irradiation atmosphere. While processing in air leads to damaged insulating regions, inert conditions yield semiconducting 2H domains, enabling direct field‐effect transistor patterning with optimized lateral 1T′‐2H MoS2 ...
Anna Zhuravlova, Minjuan Li, Osamah Alharbi, Yeonsu Jeong, Bin Han, Lei Gao, Mischa Bonn, Mario Lanza, Sheng Yang, Antonio Gaetano Ricciardulli, Paolo Samorì   +10 more
wiley   +1 more source

Conductive Hydrogels for Exogenous Sensing and Cell Fate Control

Advanced Materials, EarlyView.
We engineer electrically conductive hydrogels by combining sulfated glycosaminoglycans with semiconducting polymers. These hydrogels bind bioactive proteins, including growth factors, whose release or retention can be modulated by low‐voltage stimulation. The hydrogels are also integrated as 3D channels in organic electrochemical transistors as part of
Teuku Fawzul Akbar, Carlos Alejandro Jimenez‐Rodriguez, Railia Biktimirova, Ilka Hermes, Thomas Kurth, My Duyen Pham, Mikhail Tsurkan, Jens Friedrichs, Francis L. C. Morgan, Hans Kleemann, Olga Guskova, Uwe Freudenberg, Peter Fratzl, Carsten Werner, Christoph Tondera, Ivan R. Minev   +15 more
wiley   +1 more source

Phase Engineering of Nanomaterials (PEN): Evolution, Current Challenges, and Future Opportunities

Advanced Materials, EarlyView.
This review summarizes the synthesis, phase transition, advanced characterization spanning ex situ to in situ and operando techniques, and diverse applications of phase engineering of nanomaterials (PEN). It further outlines key challenges and future opportunities, such as phase stability, architecture control, and artificial intelligence (AI)‐driven ...
Ye Chen, Zhanxi Fan, Jingjie Ge, Qiyuan He, Zhuangchai Lai, Jiawei Liu, Chaoliang Tan, Hua Zhang   +7 more
wiley   +1 more source

A Comparative Study on Early‐Stage Icing Evaluation Techniques for Passive Ice Protection Systems

Advanced Materials Interfaces, EarlyView.
This study addresses the lack of standardized methodologies for evaluating the early‐stage icing performance of passive ice protection systems. A unified experimental protocol is proposed and applied to representative hydrophilic and hydrophobic surfaces under controlled conditions.
Lorenzo Facco, Elena Colusso, Marco Tancon, Alessandro Martucci, Riccardo Parin   +4 more
wiley   +1 more source

High‐Performance, Paper‐Based Microelectronics via a Micromodular Fabrication Process

Advanced Materials Interfaces, EarlyView.
This study demonstrates high‐performance silicon micromodular transistors on cellulose nanomaterial‐coated paper, with interconnects formed via e‐jet printing. Transistors exhibit excellent electrical properties and maintain performance under applied strain.
Rebecca K. Banner, Hubert N. Elly, Kaifan Yue, Cyra Moobed, Siddharth Kurup, Daniel Aziz, Kira L. Barton, Victor Breedveld, Eric M. Vogel, Michael A. Filler   +9 more
wiley   +1 more source

Impact of Oxygen Plasma Pre‐Treatment on Thermal Oxidation and Reliability of SiO2 on 4H‐SiC

Advanced Materials Interfaces, EarlyView.
We investigate how oxygen plasma pre‐treatment affects the thermal oxidation of silicon carbide. While plasma modification increases growth rates by 84%, it reduces dielectric breakdown strength by 18%. Our findings reveal that although plasma improves the interface state density, it introduces structural damage, highlighting a critical trade‐off ...
Chezhiyan Nanjappan, Michael Stöger‐Pollach, Georg Pfusterschmied, Ulrich Schmid   +3 more
wiley   +1 more source

Bayesian Optimization for the Formation of Vertically Oriented Silicon Structures Using Langmuir-Blodgett Colloidal Lithography and Plasma Chemical Etching. [PDF]

ACS Omega
Osipov A, Fumina A, Belyanov I, Speshilova A, Endiiarova E, Gerdt A.   +5 more
europepmc   +1 more source

Plasma‐Sequence‐Engineered Atomic Layer Deposition of Ultra‐Thin SiNx for Enhanced Etching Resistance in Extreme Ultraviolet Pellicles

Advanced Materials Interfaces, EarlyView.
Plasma‐sequence‐engineered ALD (PSE‐ALD), based on sequential NH3 and N2 plasma pulses, enables ultrathin, dense SiNx films. ToF‐MS analysis confirms ligand removal via HCl evolution, while increased film density indicates network densification. The resulting SiNx coating provides robust protection of graphite under H2 plasma exposure.
Hye‐Young Kim, Sung Kyu Jang, Jihun Kim, Jong‐Hyun Choi, Ji‐Beom Yoo, Hyun‐Mi Kim, Seul‐Gi Kim, Hyeongkeun Kim   +7 more
wiley   +1 more source

Oxygen Plasma-Modified Graphene Composite Membranes for Enhanced Forward Osmosis Performance: Mitigating Reverse Salt Flux and Improving Permeability. [PDF]

Membranes (Basel)
Zhang K, Wu Y, Jiang Y, Han Q, Zhang M, Feng L, Zhang L.   +6 more
europepmc   +1 more source