Results 241 to 250 of about 96,312 (290)
Facile, etch-free atomic layer-coated resist templates for rapid prototyping of efficient visible metasurfaces. [PDF]
Seong J +8 more
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Comparative Growth and Functional Integration of CeO<sub>2</sub> Films via Plasma-Enhanced and Thermal ALD Using a Tailored Cerium Precursor for Artificial Synaptic Devices. [PDF]
Seo Y +6 more
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Plasma-enhanced atomic layer deposition of transition metal phosphates
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Patterned deposition by plasma enhanced spatial atomic layer deposition
Physica Status Solidi - Rapid Research Letters, 2011AbstractAn atmospheric pressure plasma enhanced atomic layer deposition reactor has been developed, to deposit Al2O3 films from trimethyl aluminum and an He/O2 plasma. This technique can be used for 2D patterned deposition in a single in‐line process by making use of switched localized plasma sources.
Fred Roozeboom
exaly +4 more sources
Plasma-Enhanced Atomic Layer Deposition of Silver Thin Films
Chemistry of Materials, 2011Thermal properties of various silver precursors known in the literature were evaluated in order to discover which precursor is the most suitable one for plasma-enhanced atomic layer deposition (PEALD) of silver thin films. Ag(fod)(PEt3) (fod = 2,2-dimethyl-6,6,7,7,8,8,8-heptafluorooctane-3,5-dionato) was found to be the best choice. Using Ag(fod)(PEt3)
Jaakko Niinistö +2 more
exaly +3 more sources
Plasma-enhanced atomic layer deposition of BaTiO3
Scripta Materialia, 2016Abstract Among high-k thin films, perovskite BaTiO3 (BTO) is an attractive candidate due to its exceptionally high dielectric constant. In contrast to conventional atomic layer deposition (ALD), plasma-enhanced ALD (PEALD) has several advantages such as lower process temperature, improved film quality and the deposition of a wider spectrum of ...
Peter Schindler +4 more
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Plasma-Enhanced Atomic Layer Deposition of Ni
Japanese Journal of Applied Physics, 2010Ni plasma enhanced atomic layer deposition (PE-ALD) using bis(dimethylamino-2-methyl-2-butoxo)nickel [Ni(dmamb)2] as a precursor and NH3or H2plasma as a reactant was comparatively investigated. PE-ALD Ni using NH3plasma showed higher growth rate, lower resistivity, and lower C content than that using H2plasma.
Lee, HBR +8 more
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Plasma-enhanced atomic layer deposition of tungsten nitride
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 2016Tungsten nitride (WN) has potential as an interconnect barrier film. Deposition of WN films with bis(tert-butylimido)bis(dimethylamido)tungsten utilizing plasma-enhanced atomic layer deposition has been investigated over a temperature range of 100–400 °C employing N2, H2/N2, and NH3 remote plasmas.
Mark J. Sowa +3 more
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Plasma-enhanced atomic layer deposition for plasmonic TiN
Nanophotonic Materials XIII, 2016This work presents the low temperature plasma-enhanced atomic layer deposition (PE-ALD) of TiN, a promising plasmonic synthetic metal. The plasmonics community has immediate needs for alternatives to traditional plasmonic materials (e.g. Ag and Au), which lack chemical, thermal, and mechanical stability.
Lauren M. Otto +7 more
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