Results 101 to 110 of about 2,786,485 (335)
Aluminum (Al) alloy 6061 is often used in engineering applications due to its high strength, excellent fracture toughness, and corrosion resistance. Lots of material removal or machining processes would induce some undesirable side effects like surface ...
Chin-Guo Kuo +3 more
doaj +1 more source
Highlights of 10th plasma chemistry meeting [PDF]
The chemical structure is given of a film formed by plasma polymerization from pyridine monomers. The film has a hydrophilic chemical structure, its molecular weight is 900, and the molecular system is C55H50N10O3.
Hashimoto, H., Hozumi, K., Kitamura, K.
core +1 more source
Surface Modification of a PCB Substrate for Better Adhesion of Inkjet Printed Circuit Structures [PDF]
The robustness and service life of inkjet printed electronic circuit structures are highly influenced by the state of the interface between these structures and the substrate.
Akkerman, R. +2 more
core +1 more source
Isotropic Atomic Layer Etching of ZnO Using Acetylacetone and O2 Plasma
Atomic layer etching (ALE) provides Ångström-level control over material removal and holds potential for addressing the challenges in nanomanufacturing faced by conventional etching techniques.
A. Mameli +4 more
semanticscholar +1 more source
We report phosphine‐oxide interlayers for wide‐bandgap perovskite solar cells, in which tuned P = O Lewis basicity enables selective passivation of buried NiOx/perovskite interfaces and introduces interfacial dipoles that strengthen the built‐in field.
JeeHee Hong +6 more
wiley +1 more source
High-density plasma etching characteristics of aluminum-doped zinc oxide thin films in Cl2/Ar plasma
We investigated the etching characteristics of aluminum-doped zinc oxide (AZO) thin films in an adaptively coupled plasma (ACP) system. The dry etching characteristics of AZO films were studied by changing the Cl _2 /Ar gas mixing ratio, RF power, DC ...
Liting Zhang +3 more
doaj +1 more source
Atomic Layer Deposition in Transistors and Monolithic 3D Integration
Transistors are fundamental building blocks of modern electronics. This review summarizes recent progress in atomic layer deposition (ALD) for the synthesis of two‐dimensional (2D) metal oxides and transition‐metal dichalcogenides (TMDCs), with particular emphasis on their enabling role in monolithic three‐dimensional (M3D) integration for next ...
Yue Liu +5 more
wiley +1 more source
Cryogenic plasma deep-etching for silicon sub-micron structures was studied with the use of modified poly(styrene) (PS) perforated masks obtained from laterally phase separated PS and poly (lactic acid) PLA blend thin films.
M. Kulsreshath +7 more
doaj +1 more source
Silicon flower structures by maskless plasma etching. [PDF]
Zhao G +6 more
europepmc +1 more source
A MXene/PEDOT coating enables multimodal functionality and dual‐analyte detection of dopamine and serotonin in flexible microelectrode arrays while enhancing electrophysiological recording quality. The anti‐fouling, low‐impedance interface overcomes key limitations of conventional coatings, providing a robust and versatile platform to investigate the ...
Ilaria Gatti +8 more
wiley +1 more source

