Results 231 to 240 of about 1,458,991 (299)

Twin‐Lever Multifunctional Meta‐Optics With High Longitudinal Tolerance

open access: yesAdvanced Science, EarlyView.
We introduce a single‐layer, CMOS‐compatible metasurface that allows for polarization‐programmable, achromatic broadband dual‐mode imaging with high longitudinal tolerance. The twin‐lever design combines bright‐field focusing and vortex‐based edge‐enhanced imaging while managing axial intensity distribution from 488 to 633 nm.
Isma Javed   +10 more
wiley   +1 more source

Submicron microdevice patterning with plasma-thinned nail-polish microfiber shadow masks. [PDF]

open access: yesNanoscale Adv
Xie Y   +5 more
europepmc   +1 more source

Force‐Electric Nanotentacles of Tantalum Implant Accelerate Cellular Energy Metabolism/Crosstalk for Immunomodulation‐Vascularized Bone Integration

open access: yesAdvanced Science, EarlyView.
A biomimetic force‐electric nanotentacle‐enabled tantalum (Ta) implant with surface‐nanostructured LiTaO3 (n‐LiTaO3) was first developed via laser nanofabrication combined with Li+‐induced in situ reaction, enabling the transduction of ultrasound into bioelectrical cues.
Taixing Zhang   +15 more
wiley   +1 more source

High-Efficiency Sub-100 nm Gate GaN HEMTs Enabled by Two-Step SiN<sub>x</sub> Layer Etching Technique. [PDF]

open access: yesMicromachines (Basel)
Cao X   +13 more
europepmc   +1 more source
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The Behaviour of the Etching Rate in a Model of Plasma Etching

ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 1994
AbstractDiese Arbeit ist sowohl der Modellierung einiger Oberflächen‐ und Volumenprozesse beim Plasmaätzen durch gewöhnliche Differentialgleichungen als auch der qualitativen Untersuchung des resultierenden Systems gewidmet. Die explizite Konstruktion von Attraktoreinhüllenden erlaubt, die Ätzrate des Prozesses durch eine Folge von Schranken ...
Kern, Marietta, Koksch, Norbert
openaire   +1 more source

Plasma etching—A discussion of mechanisms

Journal of Vacuum Science and Technology, 1979
The purpose of the present paper is to review the salient features of our understanding of phenomena which occur in plasma etching situations. The etching process is discussed in terms of three basic steps: adsorption, product formation, and product desorption.
J. W. Coburn, Harold F. Winters
openaire   +1 more source

Plasma Etching of Sialon

Journal of the American Ceramic Society, 1983
A new technique is presented for the etching of sialon and Si 3 N 4 for microstructural control purposes. This technique, plasma etching, is rapid and delineates both β‐sialon and glassy phases
Chris Chatfield, Hans Norström
openaire   +1 more source

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