Chemical Mechanical Polishing of Zerodur<sup>®</sup> Using Silica and Ceria Nanoparticles: Toward Ultra-Smooth Optical Surfaces. [PDF]
Bellahsene H +10 more
europepmc +1 more source
Beyond the Sober State: The Work of Drunkenness in British Bureaucracy
ABSTRACT This article reports the drinking stories of British civil service clerical workers based at a large civil service office complex located in Newcastle upon Tyne between 1968 and 1993. It uses these stories to develop an account of state formation that takes seriously the place of joy, solidarity, contention, and exhaustion within public sector
Michael Vine
wiley +1 more source
A Novel Method of Adding Sucrose in Fixed Abrasive Pads for Self-Conditioning. [PDF]
Ma F +6 more
europepmc +1 more source
Flow-Induced Dynamic Dispersion in Dispersant-Free Mixed-Oxide Slurry Systems. [PDF]
Lin YA +6 more
europepmc +1 more source
A Brief Introductory Guide to Nanoindentation for Comparative and Evolutionary Biologists, with a Case Study of Bone Material Property Diversity across Artiodactyl Skulls. [PDF]
Adams DS +6 more
europepmc +1 more source
Biomechanical effects of soft and rigid passive back occupational exoskeletons during load-carrying and static trunk bending tasks in the aeronautics industry. [PDF]
Albouy T, Mornieux G, Chin E, Zare M.
europepmc +1 more source
Effect of Fluorescent Adhesives on Visibility and Tooth Enamel Surface Properties After Debonding: A Systematic Review and Meta-Analysis. [PDF]
Omidkhoda M +3 more
europepmc +1 more source
Probing the Nanoscale Onset of Plasticity in Electroplated Copper for Hybrid Bonding Structures via Multimodal Atomic Force Microscopy. [PDF]
Alderete NA +3 more
europepmc +1 more source
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AbstractA new concept for CNC polishing pads is given by the gradient index (GRIN) pad polishing tools. Instead of gluing polishing foils as a layer onto metallic tool holders that have the spherical surface to be polished, 3D‐printed GRIN pads are applied directly to the CNC tool axis.
Oliver Fähnle +9 more
openaire +2 more sources
Variation of polish pad shape during pad dressing
Materials Science and Engineering: B, 1999Abstract In silicon wafer polishing and CMP processes, polish pad dressing (conditioning) is often used to restore pad performance. In this report, variation of polish pad shape during dressing is studied by using diamond-plated cup wheels and sandpaper rings, respectively. Result shows that pad shape becomes concave after certain amount of dressing.
Yi-yang Zhou, Eugene C Davis
openaire +1 more source

