Results 211 to 220 of about 2,424 (264)
Some of the next articles are maybe not open access.
Thermal Effects of Mechanical Polishing and Conditioning on Polishing Pads
Key Engineering Materials, 2015Polishing process is a primary technique for planarization of material surface in manufacture fabrication. The pad structure and its material properties are important to determine the polish rate and planarity that can be achieved by the polishing process.
Hung Jung Tsai, Chia Hao Chuang
openaire +1 more source
A statistical polishing pad model for chemical-mechanical polishing
Proceedings of IEEE International Electron Devices Meeting, 2002Chemical mechanical polishing (CMP) has emerged as a critical technology for advanced integrated circuit fabrication. This paper presents for the first time a physical CMP model that includes the effects of polishing pad roughness and dynamic interaction between pad and wafer.
null Tat-Kwan Yu, C.C. Yu, M. Orlowski
openaire +1 more source
Modeling of Polishing Pad Wear in Chemical Mechanical Polishing
Key Engineering Materials, 2010The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.
Mao Li, Yong Wei Zhu, Jun Li, Kui Lin
openaire +1 more source
Effect of Polishing Time and Pressure on Polishing Pad Performance
Key Engineering Materials, 2008This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate (MRR) of single crystal silicon. It was found that as the pad deteriorates with time, MRR decreases. Surfaces with a required quality can only be achieved before the texture deterioration reaches a critical limit. At a
A.Q. Biddut, Liang Chi Zhang, Y.M. Ali
openaire +1 more source
2004
Although polishing is an old technology [1, 2, 3], it has become an enabling process for the manufacture of leading-edge semiconductor devices. In the manufacture of such devices, polishing is used to maintain planarity at each step in the process of depositing and photolithographically imaging sequential insulating dielectric and conductive metal ...
openaire +1 more source
Although polishing is an old technology [1, 2, 3], it has become an enabling process for the manufacture of leading-edge semiconductor devices. In the manufacture of such devices, polishing is used to maintain planarity at each step in the process of depositing and photolithographically imaging sequential insulating dielectric and conductive metal ...
openaire +1 more source
The figure simulation of the polishing pad in the continuous polishing process
SPIE Proceedings, 2014The figures of the polishing pad are of great significance for the figures of optical workpieces in the continuous polishing process. Three main factors which affect the figures of the pad, including the polishing pad creep deformation, the calibration plate grinding and the ambient change in temperature, are analyzed in this work.
Haiyang Shan +6 more
openaire +1 more source
Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad
Advanced Materials Research, 2010The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of
Mao Li +4 more
openaire +1 more source
Stochastic Models for Pad Structure and Pad Conditioning Used in Chemical-Mechanical Polishing
Journal of Engineering Mathematics, 2006zbMATH Open Web Interface contents unavailable due to conflicting licenses.
Wiegand, Susanne, Stoyan, Dietrich
openaire +2 more sources
Characteristics in chemical-mechanical polishing of copper: comparison of polishing pads
Applied Surface Science, 1997Abstract A systematic study of Cu CMP in terms of the effect of polishing pad properties on the process characteristics has been performed. The IC 1000 and IC 1000/SUBA IV polishing pads were compared with regard to the polish rates, across-wafer uniformity, planarity and pattern sensitivity of the CMP process. Polishing with the IC 1000/SUBA IV pad,
Z. Stavreva +3 more
openaire +1 more source
ADDITIVE MANUFACTURING OF POLISHING PADS
2021CHAUDHARI ATUL BHASKAR +2 more
openaire +7 more sources