Results 231 to 240 of about 2,582 (264)

Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations

International Journal of Machine Tools and Manufacture, 2013
Seong-Hyun Kim, Eun-Sang Lee
exaly  

Polishing system, polishing pad, and related methods

2023
BARKAM SWETHA, LOW KHIAM-HOW, CULTRA JAMES A   +2 more
openaire   +1 more source

Dependence of pad performance on its texture in polishing mono-crystalline silicon wafers

International Journal of Mechanical Sciences, 2010
L C Zhang, Y M Ali
exaly  

Polishing Characteristics of Hydrophilic Pad in Chemical Mechanical Polishing Process

Materials and Manufacturing Processes, 2012
Ming-Yi Tsai
exaly  

Polishing pad for reducing edge roll-off while maintaining good global flatness of silicon wafer

Precision Engineering, 2020
Urara Satake, Toshiyuki Enomoto
exaly  

Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

Journal of Materials Processing Technology, 2014
Geok Soon Hong, Ji Zhao, Yoke San Wong
exaly  

Polishing pad for electrochemical mechanical polishing

2005
COOK LEE MELBOURNE, JAMES DAVID B, ROBERTS JOHN V H   +2 more
openaire   +1 more source

Investigation of a Novel Diamond Disk's Effect on Pad Topography in Oxide Chemical Mechanical Polishing

Materials and Manufacturing Processes, 2010
Ming-Yi Tsai
exaly  

Formulations for advanced polishing pads

2023
GANAPATHIAPPAN SIVAPACKIA, VORA ANKIT, FU BOYI, HARIHARAN VENKAT, YAMAMURA MAYU, CORNEJO MARIO, ABRAMSON IGOR, YANG MO, REDFIELD DANIEL, BAJAJ RAJEEV, PATIBANDLA NAG B   +10 more
openaire   +1 more source

Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process

Wear, 2017
Taesung Kim, Cheolmin Shin, Seokjun Hong
exaly