Results 191 to 200 of about 4,301 (207)
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Power cycling on press-pack IGBTs: measurements and thermomechanical simulation
Microelectronics Reliability, 1999Abstract Press-pack IGBTs are increasing their market-share, especially for traction applications. As packaging performance is a key factor for a successful product, there is a great interest in defining optimal solutions in terms of geometry, materials and mechanical loading.
COVA, Paolo +4 more
openaire +2 more sources
Methods for Testing and Online Monitoring of Key Parameters in Press-Pack IGBT Devices
China International Forum on Solid State LightingThis paper addresses the issue of directly and accurately measuring the junction temperature of press-fit IGBT modules during operation. A joint temperature measurement method based on fiber optic sensing and the K coefficient method is proposed.
Luping Yang +4 more
semanticscholar +1 more source
Thermo-mechanical finite element analysis in press-packed IGBT design
Microelectronics Reliability, 2000Abstract The reliability of press-packed insulated gate bipolar transistors (IGBTs) depends on satisfactory contact conditions applied at assembly stage and maintained throughout the service life. The objective of this work is the simulation of stresses and strains in press-packed IGBTs due to assembly and thermal cycling.
PIRONDI, Alessandro +4 more
openaire +2 more sources
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
Microelectronics internationalThis study aims to understand the phenomenon of stress relaxation in the gate pin of press-pack IGBT devices due to the coupling effect of electrical, thermal and mechanical fields, gate pin stress relaxation life model based on multiphysics field ...
Yuqi Wang +8 more
semanticscholar +1 more source
2024 4th International Conference on Electronic Materials and Information Engineering (EMIE)
Press-pack insulated gate bipolar transistor (IGBT) is widely used in transmission systems due to its high reliability and short-circuit failure modes. However, there is a lack of research on the failure mechanism of elastic press-pack IGBT.
Boyang Zhang +5 more
semanticscholar +1 more source
Press-pack insulated gate bipolar transistor (IGBT) is widely used in transmission systems due to its high reliability and short-circuit failure modes. However, there is a lack of research on the failure mechanism of elastic press-pack IGBT.
Boyang Zhang +5 more
semanticscholar +1 more source
Thermal Cross-Coupling Effect Anaysis of Compliant Press-Pack IGBT Submodule
2024 3rd Asia Power and Electrical Technology Conference (APET)Compliant press-pack IGBT (PPI) modules are extensively utilized in high-voltage direct current (HVDC) transmission systems. To support high current capacity, multiple IGBT/FWD chips are connected in parallel on a common baseplate.
Yang Xu +4 more
semanticscholar +1 more source
Study on the Effect of Test Condition on Thermal Resistance of the Press-Pack IGBT Module
International Conference on Electronic Packaging TechnologyPress-Pack IGBT modules (PP-IGBT) are the key components in an electronic system. It is of great importance to study on the thermal resistance especially for thermal resistance, reliability, and life prediction.
Yangyi Shen +6 more
semanticscholar +1 more source
Press-pack IGBTs, semiconductor switches for pulse power
PPPS-2001 Pulsed Power Plasma Science 2001. 28th IEEE International Conference on Plasma Science and 13th IEEE International Pulsed Power Conference. Digest of Papers (Cat. No.01CH37251), 2001F. Wakeman, W. Findlay, null Gangru Li
openaire +1 more source
Study on thermal buffering effect of phase change material on press- pack IGBT
International Journal of Heat and Mass Transfer, 2020Hai Ren, Li Ran
exaly