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Sidewall Tapering in Reactive Ion Etching
Journal of The Electrochemical Society, 1985On signale un phenomene de retrecissement suivant les parois laterales en gravure ionique reactive, avec une pente ∼75°. Une facette du masque de photoresist se forme a cause de la variation angulaire de la vitesse de perte de resist. L'angle de la facette avec le plan vertical est d'environ 16° et sa vitesse de propagation plus de deux fois la vitesse
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Role of ions in reactive ion etching
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1994Energetic ion bombardment is responsible for the anisotropic etching which can be obtained in reactive ion etching. This has been recognized for many years but the detailed mechanisms involved in this process are still not well understood. In this paper, the various phenomena resulting from ion bombardment of a surface in a reactive gas glow discharge ...
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Reactive Ion Etching of Tantalum in Silicon Tetrachloride
SSRN Electronic Journal, 2022Asaad K. Edaan Al-mashaal +1 more
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Influence of resists on reactive ion etching
Czechoslovak Journal of Physics, 1993In the course of plasma etching we can observe a loading effect, i.e. the etch rate depends on the size of the etched surface exposed to the plasma. This phenomenon was explained according to Mogab by the plasma active etch species depletion via a rapid etch reaction.
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Deep reactive ion etching as a tool for nanostructure fabrication
Journal of Vacuum Science & Technology B, 2009Jikui Luo +2 more
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