Results 241 to 250 of about 99,199 (301)

Achieving semiconductor equipment reliability

Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium, 2003
It is noted that the increasing complexity of semiconductor manufacturing processes and the competitiveness of worldwide device production demand step function improvements in production equipment reliability and predictability of its availability for use.
N. Bright, D. Ditmore, R. Dudley, J. Stewart   +3 more
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Elements of semiconductor-device reliability

Proceedings of the IEEE, 1974
Semiconductor-device quality and reliability are discussed in the context of the major factors producing failures, the relationship of process technology and its control to device quality and reliability, the testing procedures used to determine quality levels, and screening procedures that can be employed to segregate certain levels of device quality.
T.D. George, J.D. Adams, S.L. Carrell, C.G. Peattie, M.H. Valek   +4 more
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Semiconductor Device Reliability

1989
I. Reliability Testing.- 1.1 The Influence of Temperature and Use Conditions on the Degradation of LED Parameters.- 1.2 An Historical Perspective of GaAs MESFET Reliability Work at Plessey.- 1.3 Screening and Burn-In: Application to Optoelectronic Device Selection for High-Reliability S280 Optical Submarine Repeaters.- 1.4 Assuring the Reliability of ...
B. A. Unger, A. Christou
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Reliability investigation of semiconductor coolers

XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291), 2002
The life tests on the thermoelectric shock of semiconductor coolers show that the life of semiconductor coolers follows the Weibull distribution. After the early failed devices are removed, the failure rule of the devices can be described as an exponential distribution. The main failure mode is the crack between electric couple material and welding pad.
Chen Lunqiang, Lui Jingwei, Quan Wuyun, Liu Xiaowei, Sun Shufang, Wang Xilian, Liu Zhenmao, Ye Shuichi   +7 more
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Reliability of MgAI Semiconductor Interconnects

IEEE Transactions on Reliability, 1970
Data are presented comparing 1-percent MgAI wire with 1-percent SiAI wire for ultrasonically bonded interconnects on semiconductor devices. The effects of annealing time and temperature on the strength of the wire demonstrate the mechanical superiority of the 1-percent MgAI wire.
Dean R. Collins, John M. Pankratz
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A reliability appraisal of semiconductor devices

Proceedings of the IEE - Part B: Electronic and Communication Engineering, 1959
The current problems of assessing the reliability of semiconductor devices are discussed, and reference is made to the order of reliability required in typical applications.The evidence from life tests carried out on devices drawn from production lines of transistors and diodes shows how variations in operating conditions and assessment levels affect ...
R. Brewer, W.W.D. Wyatt
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On the Relationship of Semiconductor Yield and Reliability

IEEE Transactions on Semiconductor Manufacturing, 2005
Traditionally, semiconductor reliability has been estimated from the life tests or accelerated stress tests at the completion of manufacturing processes. Recent research, however, has been directed to reliability estimation during the early production stage through a relation model of yield and reliability.
Ming J. Zuo, Way Kuo, Kyungmee O. Kim
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Semiconductor laser reliability

SPIE Proceedings, 1998
In this paper, a review of the state-of-the-art in semiconductor laser diode reliability is presented, with a particular regard to the reliability of laser diodes used in long-distance telecommunication system. Remarkable advances in semiconductor laser reliability have been demonstrated over their thirty year history, leading to estimated median ...
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Durability and Reliability of Semiconductor Devices

MRS Proceedings, 1998
AbstractThe aim of the study is to discuss the most general aspects of semiconductor devices durability and reliability. The life time of a semiconductor device is related to the defect structure evolution of the crystalline and noncrystalline components involved.
V. G. Sidorov, V. I. Sokolov, D. V. Sidorov   +2 more
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Optical semiconductor device reliability

Microelectronics Reliability, 2002
Abstract Based on the degradation modes and mechanisms clarified in 1980s and 1990s, reliability of laser diodes and photodiodes is discussed for application to current optical fiber networks such as communication systems employing wavelength-division-multiplexing technique (WDM), high-frequency modulation technique, etc.
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