Results 131 to 140 of about 3,312 (212)

Stability-Enhanced Resistive Random-Access Memory via Stacked In _x Ga_1-x O by the RF Sputtering Method. [PDF]

ACS Omega, 2021
Huang WL, Lin YZ, Chang SP, Lai WC, Chang SJ.   +4 more
europepmc   +1 more source

Recent Advances of Slip Sensors for Smart Robotics

Advanced Materials Technologies, EarlyView.
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang, Liao Wu, Shuai He, Zhao Sha, Yuwan Huang, Shuying Wu, Dewei Chu, Chun H. Wang, Shuhua Peng   +8 more
wiley   +1 more source

An overview of critical applications of resistive random access memory. [PDF]

Nanoscale Adv
Zahoor F, Nisar A, Bature UI, Abbas H, Bashir F, Chattopadhyay A, Kaushik BK, Alzahrani A, Hussin FA.   +8 more
europepmc   +1 more source

Hydrogel‐Based Functional Materials: Classifications, Properties, and Applications

Advanced Materials Technologies, EarlyView.
Conductive hydrogels have emerged as promising materials for smart wearable devices due to their outstanding flexibility, multifunctionality, and biocompatibility. This review systematically summarizes recent progress in their design strategies, focusing on monomer systems and conductive components, and highlights key multifunctional properties such as
Zeyu Zhang, Zao Cheng, Patrizio Raffa
wiley   +1 more source

A Plasmonic Optoelectronic Resistive Random-Access Memory for In-Sensor Color Image Cryptography. [PDF]

Adv Sci (Weinh)
Yang Q, Kang Y, Zhang C, Chen H, Zhang T, Bian Z, Su X, Xu W, Sun J, Wang P, Xu Y, Yu B, Zhao Y.   +12 more
europepmc   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source

Scanning Thermal Microscopy Method for Self-Heating in Nonlinear Devices and Application to Filamentary Resistive Random-Access Memory. [PDF]

ACS Nano
Harnack N, Rodehutskors S, Gotsmann B.
europepmc   +1 more source

Magnetic Textiles: A Review of Materials, Fabrication, Properties, and Applications

Advanced Materials Technologies, EarlyView.
Magnetic textiles (M‐textiles) are emerging as a programmable materials platform that merges magnetic matter with hierarchical textile structures. This article consolidates magnetic material classes, textile architectures, and fabrication and magnetization strategies, revealing structure–property–function relationships that govern magneto‐mechanical ...
Li Ke, Moses Kumi, Xiaoming Tao, Junhong Pu   +3 more
wiley   +1 more source

Density Functional Theory Insights into Conduction Mechanisms in Perovskite-Type RCoO₃ Nanofibers for Future Resistive Random-Access Memory Applications. [PDF]

Molecules
Hu Q, Luo H, Song C, Wang Y, Yue B, Liu J.   +5 more
europepmc   +1 more source

Stress‐Normalized Sensitivity as a Comparative Benchmark for Intrinsically Piezoresistive Nanocomposite Materials in Wearable Electronics

Advanced Materials Technologies, EarlyView.
A stress‐normalised sensitivity metric (S = G/Y) is introduced as a materials‐level benchmark for intrinsically piezoresistive nanocomposites. By decoupling electromechanical response (G) from stiffness (Y), the framework enables direct comparison across diverse systems and clarifies design trade‐offs for wearable sensors.
Conor S. Boland
wiley   +1 more source