Results 61 to 70 of about 161,989 (332)

X-ray topographic study of defects in Si-based multilayer epitaxial power devices

Modern Electronic Materials, 2016
Silicon based multilayered epitaxial structures are currently the main material for large-scale commercial fabrication of generally used power semiconductor devices such as fast recovery epitaxial diodes (FRED), isolate gate bipolar transistor (IGBT ...
Iren L. Shul'pina, Vladimir A. Kozlov
doaj   +1 more source

Simple model for efficient search of high-mobility organic semiconductors [PDF]

arXiv, 2019
High charge mobility in active layers of organic electronic devices is often necessary for their efficient operation. As a result, search for high-mobility materials among the plethora of synthesizable organic semiconductors is of paramount importance for organic electronics.
arxiv  

Predicting 2D Crystal Packing in Thin Films of Small Molecule Organic Materials

Advanced Functional Materials, EarlyView.
A computational method is proposed for predicting the 2D molecular packing in crystalline thin films of flexible organic molecules. The approach employs a grid search for molecular arrangements, achieving accurate predictions of 2D packing motifs with strongly reduced computational costs.
Alexey O. Gudovannyy, Julia M. Schäfer, Olga Gerdes, Dirk Hildebrandt, Gunter Mattersteig, Martin Pfeiffer, Frank Ortmann   +6 more
wiley   +1 more source

Large‐Scale N‐Type FET and Homogeneous CMOS Inverter Array Based on Few‐Layer MoTe2

Advanced Electronic Materials, 2023
2D MoTe2 is regarded as a favorable candidate for semiconductor nanoelectronics integration. Chemical‐vapor‐deposition‐grown MoTe2 usually presents p‐type characteristics.
Zhixuan Cheng, Xionghui Jia, Xing Cheng, Yiwen Song, Yuqia Ran, Minglai Li, Wanjin Xu, Yanping Li, Yu Ye, Lun Dai   +9 more
doaj   +1 more source

High‐Fidelity Directed Self‐Assembly Using Higher‐χ Polystyrene‐Block‐Poly(Methyl Methacrylate) Derivatives for Dislocation‐Free Sub‐10 nm Features

Advanced Functional Materials, EarlyView.
The relationship between primary polymer structure and pattern quality in the directed self‐assembly of chemically modified polystyrene‐block‐poly(methyl methacrylate) derivatives is explored. The perpendicular lamellae are aligned, with a periodicity below 20 nm. No parallel orientations or dislocations form, and line patterns are well defined over an
Shinsuke Maekawa, Lander Verstraete, Hyo Seon Suh, Takehiro Seshimo, Takahiro Dazai, Kazufumi Sato, Kan Hatakeyama‐Sato, Yuta Nabae, Teruaki Hayakawa   +8 more
wiley   +1 more source

Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET

IET Circuits, Devices and Systems, 2021
The interface trap charges (ITC) associated reliability analysis of a charge‐plasma based asymmetric double‐gate (ADG) dopingless tunnel field effect transistor (DLTFET) with Si/Ge heterojunction and high‐κ gate dielectric (HJADGDLTFET) has been studied.
Suruchi Sharma, Rikmantra Basu, Baljit Kaur   +2 more
doaj   +1 more source

Spectroscopic assessment of charge mobility in organic semiconductors [PDF]

arXiv, 2019
Rapid progress in organic electronics demands new highly efficient organic semiconducting materials. Nevertheless, only few materials have been created so far that show reliable band-like transport with high charge mobilities, which reflects the two main obstacles in the field: the poor understanding of charge transport in organic semiconductors (OSs ...
arxiv  

Making Photoresponsive Metal–Organic Frameworks an Effective Class of Heterogeneous Photocatalyst

Advanced Functional Materials, EarlyView.
This review summarizes photoresponsive MOFs for photocatalytic applications, focusing on their capacity to enhance light harvesting, charge transfer, and surface reactions. While existing studies provide foundational insights, emerging characterization techniques enable a deeper understanding of photoresponsive MOFs.
Rui Liu, Hao Wu, Hoi Ying Chung, Yun Hau Ng   +3 more
wiley   +1 more source

ICMAT 2011 – Reliability and variability of semiconductor devices and ICs

Microelectronics Reliability, 2012
Abstract not available in fulltext.
Asenov, Asen, Schlichtmann, Ulf, Tan, Cher Ming, Wong, Hei, Zhou, Xing   +4 more
openaire   +4 more sources

Bi‐Directional Assembly of Boron Nitride µ‐Platelets by Micro‐Molding for Advanced Thermal Interface Materials

Advanced Functional Materials, EarlyView.
Bi‐directionally assembled BN µ‐platelets in micropatterns formed by a micro‐molding method for thermal interface materials are demonstrated. The BN µ‐platelets are vertically aligned selectively, while compressed regions without patterns accommodate horizontally assembled BN µ‐platelets. Through anisotropic orientation, high thermal conductivities for
Young Gil Kim, In‐Young Jung, Yujin Mun, Joo Hwan Shin, Sang Gil Lee, Gyan Raj Koirala, Taewoo Kang, Jehyung Ok, Hyesu Choi, Jiwon Kim, Youngkwang Shin, Seok Joon Kwon, Tae‐il Kim   +12 more
wiley   +1 more source