Results 21 to 30 of about 770,517 (280)
Large-area metasurface on CMOS-compatible fabrication platform: driving flat optics from lab to fab
Nanophotonics, 2020 A metasurface is a layer of subwavelength-scale nanostructures that can be used to design functional devices in ultrathin form. Various metasurface-based optical devices – coined as flat optics devices – have been realized with distinction performances ...
Li Nanxi +7 more
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Recent Advances in Organic-inorganic Hybrid Photoresists
Journal of Microelectronic Manufacturing, 2021 Photoresists are radiation-sensitive materials used for forming patterns to build up IC devices. To date, most photoresists have been based on organic polymers, which have been dominating the semiconductor industries over the past few decades.
Zhihao Wang +10 more
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A 3D printed metallized Fabry–Perot cavity antenna with improved bandwidth and low side‐lobe levels
Electronics Letters, 2021 A 3D printed metallized Fabry–Perot cavity antenna centred at 5.8 GHz is presented in this letter. A non‐uniform grid superstrate and a choke groove are employed in the Fabry–Perot cavity antenna to improve the input bandwidth and decrease the side lobes.
Ke Xu, Lin Zhou, Bing Zhang, Xing Chen
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EUV Lithography Technology for High-volume Production of Semiconductor Devices
Journal of Photopolymer Science and Technology (Fotoporima Konwakai shi), 2019 After years of efforts, extreme-ultraviolet (EUV) lithography reached a significant milestone in 2018: readiness for high-volume production of advanced semiconductor devices.
J. Miyazaki, A. Yen
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Advances in Physics: X, 2018 The continuous demand for small portable electronics is pushing the semiconductor industry to develop novel lithographic methods to fabricate the elementary structures for microelectronics devices with dimensions below 10 nm.
Tommaso Jacopo Giammaria +2 more
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Lens System Adjustment in Semiconductor Lithography Equipment
Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2008 In this paper, we address the problem of lens aberration adjustment for lenses of semiconductor lithography equipment. The objective of aberration adjustment is to minimize the maximum value of aberration in any part of the images that are projected on ...
Yuji SHINANO +3 more
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Microsystems & Nanoengineering, 2017 This article discusses the transition of a form of nanoimprint lithography technology, known as Jet and Flash Imprint Lithography (J-FIL), from research to a commercial fabrication infrastructure for leading-edge semiconductor integrated circuits (ICs ...
S. Sreenivasan
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Review of Metasurfaces and Metadevices: Advantages of Different Materials and Fabrications
Nanomaterials, 2022 Flat optics, metasurfaces, metalenses, and related materials promise novel on-demand light modulation within ultrathin layers at wavelength scale, enabling a plethora of next-generation optical devices, also known as metadevices.
Wei-Lun Hsu +5 more
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Chemical Society Reviews, 2019 Spatial confinement of electrochemical reactions at solid/liquid interfaces is a mature area of research, and a central theme from cell biology to analytical chemistry.
Y. B. Vogel, J. J. Gooding, S. Ciampi
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Innovation on Line Cut Methods of Self-aligned Multiple Patterning
Journal of Microelectronic Manufacturing, 2019 Self-aligned multiple patterning (SAMP) can enable the semiconductor scaling before EUV lithography becomes mature for industry use. Theoretically any small size of pitch can be achieved by repeating SADP on same wafer but with challenges of pitch ...
Jeff Shu
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