Results 21 to 30 of about 14,706 (300)

Integration of Dye Lasers and Microfluidics for Biochemical Analysis [PDF]

, 2009
This dissertation describes the study of two important aspects of integration in microfluidics: optics and biochemistry. In optics integration, two types of miniaturized dye lasers, namely the solid-state polymer dye lasers and optofluidic dye lasers ...
Chen, Yan
core   +1 more source

Lensless metrology for semiconductor lithography at EUV [PDF]

Modeling Aspects in Optical Metrology VII, 2019
The production of modern semiconductor devices is based on photolithography, a process through which a pattern engraved on a mask is projected on a silicon wafer coated with a photosensitive material. In the past few decades, continuous technological progress in this field allowed the industry to follow Moore’s law by reducing the size of the printed ...
Iacopo Mochi, Dimitrios Kazazis, Li-Ting Tseng, Sara Fernandez, Rajendran Rajeev, Uldis Locans, Atoosa Dejkameh, Ricarda Nebling, Ekinci Yasin   +8 more
openaire   +1 more source

Automatic resist parameter calibration procedure for lithography simulation

, 2022
S.313-324The simulation of photolithographic processes depends on accurate resist modeling parameters. In this paper we present an automated fitting procedure which can be applied to arbitrary combinations of experimental data and model parameters.
Jess, M., Hoepfl, M., Erdmann, A., Majoni, S., Tollkuehn, B.   +4 more
core   +1 more source

Technological strategies for self-assembly of PS-b-PDMS in cylindrical sub-10 nm nanostructures for lithographic applications

Advances in Physics: X, 2018
The continuous demand for small portable electronics is pushing the semiconductor industry to develop novel lithographic methods to fabricate the elementary structures for microelectronics devices with dimensions below 10 nm.
Tommaso Jacopo Giammaria, Michele Laus, Michele Perego   +2 more
doaj   +1 more source

Lens System Adjustment in Semiconductor Lithography Equipment

Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2008
In this paper, we address the problem of lens aberration adjustment for lenses of semiconductor lithography equipment. The objective of aberration adjustment is to minimize the maximum value of aberration in any part of the images that are projected on ...
Yuji SHINANO, Youzou FUKAGAWA, Yoshimi TAKANO, Toshiyuki YOSHIHARA   +3 more
doaj   +1 more source

Review of Metasurfaces and Metadevices: Advantages of Different Materials and Fabrications

Nanomaterials, 2022
Flat optics, metasurfaces, metalenses, and related materials promise novel on-demand light modulation within ultrathin layers at wavelength scale, enabling a plethora of next-generation optical devices, also known as metadevices.
Wei-Lun Hsu, Yen-Chun Chen, Shang Ping Yeh, Qiu-Chun Zeng, Yao-Wei Huang, Chih-Ming Wang   +5 more
doaj   +1 more source

Development of high-speed directly-modulated DFB and DBR lasers with surface gratings [PDF]

, 2011
The conventional distributed feedback and distributed Bragg reflector edge-emitting lasers employ buried gratings, which require two or more epitaxial growth steps.
M. Dumitrescu, Sek, G., REITHMAIER J. P., EISENSTEIN G., KARINEN J., P. Bardella, P. Melanen, MELANEN P., GREADY D., SEK G., G. Sek, O. Parillaud, S. Afzal, Laakso, A., J. Telkkälä, Reithmaier J.-P., Afzal, S., P. Uusimaa, Montrosset, Ivo, D. Gready, PARILLAUD O., Melanen, P., Bardella, Paolo, Vallone, Marco Ernesto, VIHERIÄLÄ J., KAMP M., Telkkälä, J., J.-P. Reithmaier, J. Karinen, Parillaud, O., Dumitrescu, M., DUMITRESCU M., Gready, D., M. Vallone, M. Krakowski, G. Eisenstein, Uusimaa, P., Viheriälä, J., A. Laakso, I. Montrosset, Eisenstein, G., J. Viheriälä, Karinen, J., AFZAL S., LAAKSO A., TELKKÄLÄ J., UUSIMAA P., Kamp, M., M. Kamp   +48 more
core   +1 more source

Resolution enhancements for semiconductor lithography: A computational perspective

, 2022
Paper IM4F.3The presentation reviews optics- and material-driven resolution enhancements in DUV and EUV projection lithography for semiconductor fabrication with special emphasis on the application of computational methods for the exploration and ...
Erdmann, A.
core   +1 more source

Innovation on Line Cut Methods of Self-aligned Multiple Patterning

Journal of Microelectronic Manufacturing, 2019
Self-aligned multiple patterning (SAMP) can enable the semiconductor scaling before EUV lithography becomes mature for industry use. Theoretically any small size of pitch can be achieved by repeating SADP on same wafer but with challenges of pitch ...
Jeff Shu
doaj   +1 more source

Nanosphere Lithography for Nitride Semiconductors

, 2010
Ch ...
Choi, HW, Fu, WY
openaire   +4 more sources