Results 21 to 30 of about 11,186 (164)
Nanosphere Lithography for Nitride Semiconductors
, 2010 Ch ...
Choi, HW, Fu, WY
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Innovation on Line Cut Methods of Self-aligned Multiple Patterning
Journal of Microelectronic Manufacturing, 2019 Self-aligned multiple patterning (SAMP) can enable the semiconductor scaling before EUV lithography becomes mature for industry use. Theoretically any small size of pitch can be achieved by repeating SADP on same wafer but with challenges of pitch ...
Jeff Shu
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Seedless-electroplating Process Development for Micro-features Realization
International Journal of Technology, 2015 This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor ...
Yudan Whulanza +3 more
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Lensless metrology for semiconductor lithography at EUV [PDF]
Modeling Aspects in Optical Metrology VII, 2019 The production of modern semiconductor devices is based on photolithography, a process through which a pattern engraved on a mask is projected on a silicon wafer coated with a photosensitive material. In the past few decades, continuous technological progress in this field allowed the industry to follow Moore’s law by reducing the size of the printed ...
Iacopo Mochi +8 more
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Optimum Adjustment for Distortion in Semiconductor Lithography Equipment
Journal of Advanced Mechanical Design, Systems, and Manufacturing, 2008 In this paper, we consider the problem of lens distortion adjustment of semiconductor lithography equipment. The objective of adjustment is to minimize the maximum absolute value of distortion.
Youzou FUKAGAWA +2 more
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Advanced Materials Interfaces, 2023 Continuing extreme downscaling of semiconductor devices, essential for high performance and energy efficiency of future microelectronics, hinges on extreme ultraviolet lithography (EUVL) and addressing associated challenges.
Ashwanth Subramanian +7 more
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Applied SciencesSmart cities increasingly depend on chip-centered digital infrastructure, whose resilience is closely linked to the stability of upstream semiconductor manufacturing equipment supply.
Li Yu +4 more
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Ion beam induced current analysis in GaN microwires [PDF]
EPJ Web of Conferences, 2020 GaN is a wide bandgap semiconductor which is expected to withstand high radiation doses. Consequently, it is considered a promising material for new generation particle detectors in radiation related applications.
Verheij Dirkjan +8 more
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Lithography reticle scheduling in semiconductor manufacturing
Engineering Optimization, 2023 The lithography process in semiconductor dynamic random-access memory (DRAM) fabrication plants (fabs) is usually a major bottleneck, and reticle scheduling is complicated by process-specific constraints such as diversity of the product mix and rapidly changing deadlines.
Lee, Chia-Yen +4 more
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Demonstration of ACO-Based Freeform Source for ArF Laser Immersion Lithography System
IEEE Access, 2017 This paper describes the use of ArF immersion lithography to verify the feasibility of a self-developed freeform illumination source that exposes features on masks and forms resist patterns.
Frederick Lie +4 more
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