Results 31 to 40 of about 770,517 (280)
Nanosphere Lithography for Nitride Semiconductors
Ch ...
Choi, HW, Fu, WY
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Lithography reticle scheduling in semiconductor manufacturing
The lithography process in semiconductor dynamic random-access memory (DRAM) fabrication plants (fabs) is usually a major bottleneck, and reticle scheduling is complicated by process-specific constraints such as diversity of the product mix and rapidly changing deadlines.
Lee, Chia-Yen +4 more
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Seedless-electroplating Process Development for Micro-features Realization
This study aims to combine the seedless-electroplating process with maskless-lithography, as an alternative for Lithografie, Galvanoformung, Abformung (LIGA) or Lithography, Electroplating and Molding with a normal, simpler, and cheaper semiconductor ...
Yudan Whulanza +3 more
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Continuing extreme downscaling of semiconductor devices, essential for high performance and energy efficiency of future microelectronics, hinges on extreme ultraviolet lithography (EUVL) and addressing associated challenges.
Ashwanth Subramanian +7 more
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Ion beam induced current analysis in GaN microwires [PDF]
GaN is a wide bandgap semiconductor which is expected to withstand high radiation doses. Consequently, it is considered a promising material for new generation particle detectors in radiation related applications.
Verheij Dirkjan +8 more
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The Development of Photolithographic Technology and Machines [PDF]
Photolithography is the most complicated, accurate, expensive process in the manufacture of integrated circuits. The lithography machine is one of the most critical equipment in photolithographic process, which is used to duplicate the circuit ...
Zeng Ailin
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Demonstration of ACO-Based Freeform Source for ArF Laser Immersion Lithography System
This paper describes the use of ArF immersion lithography to verify the feasibility of a self-developed freeform illumination source that exposes features on masks and forms resist patterns.
Frederick Lie +4 more
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Photo‐crosslinkers, as materials with negative photoresist characteristics, are applied in the direct lithography process of organic semiconductor devices.
Yueping Lai, Liang‐Wen Feng
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The present paper considers optimization of lens adjustment in semiconductor lithography equipment. For improving productivity, the laser irradiation power of recent semiconductor lithography equipment has been boosted, which causes significant ...
Yuji SHINANO +3 more
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A kind of ultra-thin transmissive color filter based on a metal-semiconductor-metal (MSM) structure is proposed. The displayed color can cover the entire visible range and switches after H2 treatment. An indium gallium zinc oxide (IGZO) semiconductor was
Xiangrui Fan +3 more
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