Results 11 to 20 of about 11,186 (164)
Lithography Alignment Techniques Based on Moiré Fringe
In Moiré fringe lithography alignment technology, alignment is realized by monitoring the grating interference fringe image in real-time. The technique exhibits excellent sensitivity to displacement changes and is not easily affected by the gap changes ...
Wenbo Jiang +3 more
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Background: This study aimed to assess the possibility of benzene exposure in workers of a Korean semiconductor manufacturing company by reviewing the issued patents.
Sangjun Choi, Donguk Park, Yunkyung Park
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Analysis of the Cylindrical Flexure Hinges with Circular Notches [PDF]
Flexure hinges are widely used as joint linkages for precision stages applied to lithography processes. Among them, precision stages with 3 DOF (Degrees of Freedom) of x, y and θz prevail in semiconductor manufacturing and they have been adopting single ...
Jun-Hee Moon
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Large-area metasurface on CMOS-compatible fabrication platform: driving flat optics from lab to fab
A metasurface is a layer of subwavelength-scale nanostructures that can be used to design functional devices in ultrathin form. Various metasurface-based optical devices – coined as flat optics devices – have been realized with distinction performances ...
Li Nanxi +7 more
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Recent Advances in Organic-inorganic Hybrid Photoresists
Photoresists are radiation-sensitive materials used for forming patterns to build up IC devices. To date, most photoresists have been based on organic polymers, which have been dominating the semiconductor industries over the past few decades.
Zhihao Wang +10 more
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Shadow-wall lithography of ballistic superconductor–semiconductor quantum devices
Advanced fabrication techniques enable a wide range of quantum devices, such as the realization of a topological qubit. Here, the authors introduce an on-chip fabrication technique based on shadow walls to implement topological qubits in an InSb nanowire
Sebastian Heedt +18 more
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A 3D printed metallized Fabry–Perot cavity antenna with improved bandwidth and low side‐lobe levels
A 3D printed metallized Fabry–Perot cavity antenna centred at 5.8 GHz is presented in this letter. A non‐uniform grid superstrate and a choke groove are employed in the Fabry–Perot cavity antenna to improve the input bandwidth and decrease the side lobes.
Ke Xu, Lin Zhou, Bing Zhang, Xing Chen
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The continuous demand for small portable electronics is pushing the semiconductor industry to develop novel lithographic methods to fabricate the elementary structures for microelectronics devices with dimensions below 10 nm.
Tommaso Jacopo Giammaria +2 more
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Lens System Adjustment in Semiconductor Lithography Equipment
In this paper, we address the problem of lens aberration adjustment for lenses of semiconductor lithography equipment. The objective of aberration adjustment is to minimize the maximum value of aberration in any part of the images that are projected on ...
Yuji SHINANO +3 more
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Review of Metasurfaces and Metadevices: Advantages of Different Materials and Fabrications
Flat optics, metasurfaces, metalenses, and related materials promise novel on-demand light modulation within ultrathin layers at wavelength scale, enabling a plethora of next-generation optical devices, also known as metadevices.
Wei-Lun Hsu +5 more
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