Results 21 to 30 of about 22,919 (266)

A 3.0 µm Pixels and 1.5 µm Pixels Combined Complementary Metal-Oxide Semiconductor Image Sensor for High Dynamic Range Vision beyond 106 dB

Sensors, 2023
We propose a new concept image sensor suitable for viewing and sensing applications. This is a report of a CMOS image sensor with a pixel architecture consisting of a 1.5 μm pixel with four-floating-diffusions-shared pixel structures and a 3.0 μm pixel ...
Satoko Iida, Daisuke Kawamata, Yorito Sakano, Takaya Yamanaka, Shohei Nabeyoshi, Tomohiro Matsuura, Masahiro Toshida, Masahiro Baba, Nobuhiko Fujimori, Adarsh Basavalingappa, Sungin Han, Hidetoshi Katayama, Junichiro Azami   +12 more
doaj   +1 more source

High-Temperature Annealing of Random Telegraph Noise in a Stacked CMOS Image Sensor After Hot-Carrier Stress

Sensors
This paper studies the temperature effects on device aging, particularly the random telegraph noise (RTN) degradation and the threshold voltage (Vt) shift in a stacked CMOS image sensor (CIS) caused by hot-carrier stress (HCS). Measurements indicate that
Calvin Yi-Ping Chao, Thomas Meng-Hsiu Wu, Charles Chih-Min Liu, Shang-Fu Yeh, Chih-Lin Lee, Honyih Tu, Zhong-Da Wu, Joey Chiao-Yi Huang, Chin-Hao Chang   +8 more
doaj   +1 more source

End point prediction in wet etching, cleaning, and rinsing of microstructures in semiconductor manufacturing

Cleaner Engineering and Technology, 2022
Etching, cleaning, and rinsing of micro- and nano-scale features are important industrial processes in semiconductor manufacturing. This study focused on developing an adaptable process simulator that employs user-input criteria drawn from literature and
Calliandra Stuffle, Farhang Shadman
doaj   +1 more source

Online Rescheduling in Semiconductor Manufacturing

International Journal of Automation Technology, 2006
Semiconductor manufacturing rescheduling problems are difficult to solve in real time due to numerous disturbances. We focus on maintaining the existing schedule and propose online semiconductor manufacturing rescheduling. To handle temporary disturbances and obtain a new feasible schedule, our proposal revises the given schedule based on affected ...
Mingang Cheng, Masao Sugi, Jun Ota 0001, Masashi Yamamoto, Hiroki Ito, Kazuyoshi Inoue   +5 more
openaire   +1 more source

Planar Solid‐State Nanopores Toward Scalable Nanofluidic Integration Based on CMOS Technology

Advanced Engineering Materials, EarlyView.
We present a scalable silicon‐based fabrication strategy for planar solid‐state nanopores to enable their integration with complex nanofluidic systems. Prototype devices demonstrate normal voltage‐current characteristics, good noise performance, and appreciable streaming currents. Our CMOS‐compatible fabrication process offers precise geometric control
Ngan Hoang Pham, Chenyu Wen, Mohammad Hadi Khaksaran, Won‐Yong Lee, Javier Cruz, Klas Hjort, Dongping Wu, Shi‐Li Zhang   +7 more
wiley   +1 more source

A Compact Spin‐Coated Graphene UWB Antenna for Breast Tumor Detection

Advanced Engineering Materials, EarlyView.
A compact, spin‐coated graphene ultra‐wideband patch antenna designed for breast tumor detection, capable of distinguishing between malignant and benign tumors. This innovative antenna can serve as an effective initial screening tool, particularly in resource‐limited settings such as rural areas, where access to advanced medical equipment like MRI and ...
Raja Rashidul Hasan, Shuvra Saha, Sumit Hassan Eshan, Rinku Basak, Md. Nahian Al Subri Ivan, Ahmed Murtuza Saleque, Raja Tariqul Hasan Tusher, Sadia Zabin, Md. Abdur Rahman, Yuen Hong Tsang   +9 more
wiley   +1 more source

Soft Mechanical‐Electrical Logic Using Liquid Metal‐Filled 3D‐Printed Architectures

Advanced Engineering Materials, EarlyView.
We present 3D‐printed soft mechanical–electrical logic elements that use liquid metal–filled silicone tubes actuated by thermoplastic polyurethane/polylactic acid (TPU/PLA) architectures to produce Boolean operations. Complementary normally open and normally closed unit cells perform repeatable binary transitions and can be combined into more complex ...
Christoph Lehmann, Ryan Kalgreen, Laura M. Comella   +2 more
wiley   +1 more source

DC Characteristics Optimization of a Double G-Shield 50 V RF LDMOS

Advances in Condensed Matter Physics, 2015
An N-type 50 V RF LDMOS with a RESURF (reduced surface field) structure of dual field plates (grounded shield, or G-shield) was investigated. The effect of the two field plates and N-drift region, including the junction depth and dopant concentration, on
Xiangming Xu, Pengliang Ci, Xiaoyu Tang, Jing Shi, Zhengliang Zhou, Jingfeng Huang, Peng-Fei Wang, David Wei Zhang   +7 more
doaj   +1 more source

A Dislocation Perspective on Strength and Toughness in Ceramics

Advanced Engineering Materials, EarlyView.
Dislocations in ceramics enjoy a long but yet under‐appreciated history. The three research waves for dislocations in ceramics highlight the topic evolution over the last 90 years. This review focuses on the impact of dislocation on strength and toughness in ceramics.
Xufei Fang
wiley   +1 more source

Intermediate Resistive State in Wafer‐Scale Vertical MoS2 Memristors Through Lateral Silver Filament Growth for Artificial Synapse Applications

Advanced Functional Materials, EarlyView.
In MOCVD MoS2 memristors, a current compliance‐regulated Ag filament mechanism is revealed. The filament ruptures spontaneously during volatile switching, while subsequent growth proceeds vertically through the MoS2 layers and then laterally along the van der Waals gaps during nonvolatile switching.
Yuan Fa, Milan Buttberg, Ke Ran, Rana Walied Ahmad, Dennis Braun, Lukas Völkel, Jimin Lee, Sofía Cruces, Bart Macco, Bárbara Canto, Holger Lerch, Thorsten Wahlbrink, Holger Kalisch, Michael Heuken, Andrei Vescan, Joachim Mayer, Zhenxing Wang, Ilia Valov, Stephan Menzel, Max C. Lemme   +19 more
wiley   +1 more source