Results 91 to 100 of about 174,219 (285)
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
To address the issues of low mechanical strength, high anisotropy and reduced corrosion resistance in wire and arc additive manufacturing (WAAM) duplex stainless steel caused by coarse grains and columnar crystal epitaxial growth, SiC particles were ...
Haidong WANG +4 more
doaj +1 more source
Effect of SiC Radiation Damage on High Temperature Oxidation Resistance
Silicon carbide (SiC) materials have many excellent properties, especially high temperature oxidation resistance, radiation resistance and low reaction activity in the presence of water vapor.
SONG Jie;LIAO Qing;LI Bingsheng;FENG Zongkai;YANG Junyuan
doaj
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source
A Review on Microreactor Design for Effective Fischer–Tropsch Process Intensification
Design strategies for effective Fischer–Tropsch process intensification are summarized based on experimental and simulation experiences. Recommendations for catalyst loading of packed‐bed and wash‐coated microchannel, microtube, micromonolith, and microstructured reactors are discussed.
Yangjun Wei +5 more
wiley +1 more source
Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley +1 more source
An investigation on thermal shock resistance of ZrB2-SiC composites
Bahador Abolfathnezhad +2 more
openalex +1 more source
A metal‐based thermal metasurface supporting bound states in the continuum is demonstrated and experimentally shown to achieve a record‐high quality factor of 202 and high emissivity of 0.82. The design offers thermally stable, narrowband mid‐infrared emission, making it ideal for high‐precision gas sensing applications.
Guodong Zhu +8 more
wiley +1 more source
Maia, José Antonio, Palomo, Lúcia Mara
+6 more sources

