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Failure and reliability analysis of STT-MRAM

Microelectronics Reliability, 2012
Abstract Spin Transfer Torque Magnetic RAM (STT-MRAM) promises low power, great miniaturization prospective (e.g. 22 nm) and easy integration with CMOS process. It becomes actually a strong non-volatile memory candidate for both embedded and standalone applications.
Weisheng Zhao 0001   +6 more
openaire   +2 more sources

STT-MRAM-Based Reliable Weak PUF

IEEE Transactions on Computers, 2022
In recent years, micro-nano device characteristics like ferroelectrics and resistive switching are being used to build important security primitives such as Physical Unclonable Function (PUF). The micro-nano device-based hardware security primitives, although with higher security, energy efficiency, and integration density, suffer from serious ...
Yupeng Hu 0004   +6 more
openaire   +2 more sources

Security primitives (PUF and TRNG) with STT-MRAM

2016 IEEE 34th VLSI Test Symposium (VTS), 2016
The rapid development of low power, high density, high performance SoCs has pushed the embedded memories to their limits and opened the field to the development of emerging memory technologies. The Spin-Transfer-Torque Magnetic Random Access Memory (STT-MRAM) has emerged as a promising choice for embedded memories due to its reduced read/write latency ...
Vatajelu, Elena Ioana   +2 more
openaire   +3 more sources

STT-MRAM-Based Strong PUF Architecture

2015 IEEE Computer Society Annual Symposium on VLSI, 2015
Physically Unclonable Functions (PUFs) are emerging cryptographic primitives used to implement low-cost device authentication and secure secret key generation. Weak PUFs (i.e., devices able to generate a single signature or to deal with a limited number of challenges) and Strong PUFs (i.e., devices able to deal with multiple challenges) are widely ...
Vatajelu, Elena Ioana   +3 more
openaire   +1 more source

Accelerating STT-MRAM Ramp-up Characterization

2020 18th IEEE International New Circuits and Systems Conference (NEWCAS), 2020
Systematic characterization is crucial for magnetic tunnel junction from initial stack development to the final mass production. It has a direct impact on the wafer turn-around time and time to market. Under these circumstances, device characterization of the magnetic tunnel junction (MTJ) stack configuration is a critical step in the product ...
Govind Radhakrishnan   +2 more
openaire   +2 more sources

Reliability of STT-MRAM for various embedded applications

2021 IEEE International Reliability Physics Symposium (IRPS), 2021
Owing to tunability of MTJ stack characteristics based on perpendicular magnetic anisotropy control via sophisticated magnetic material engineering, STT-MRAM can meet a wide range of product specifications for various applications: 1) flash-type applications such as microcontroller and AI inferencing device and 2) SRAM-type applications such as frame ...
Shinhee Han   +12 more
openaire   +2 more sources

A Reconfigurable Arbiter PUF Based on STT-MRAM

2021 IEEE International Symposium on Circuits and Systems (ISCAS), 2021
With the rapid development of the Internet of Things (IoT) infrastructure, electronic devices are becoming ubiquitous, in which authentication and secure communication are required. As a result, novel hardware security primitives have been developed to overcome the deficiencies of conventional security methods and address the growing security issues ...
Rashid Ali   +6 more
openaire   +2 more sources

STT MRAM patterning challenges

SPIE Proceedings, 2013
In this paper we report on the patterning challenges for the integration of Spin-Transfer Torque Magneto-Resistive- Random-Access Memory (STT MRAM). An overview of the different patterning approaches that have been evaluated in the past decade is presented.
Werner Boullart   +8 more
openaire   +1 more source

Etching Methods for STT-MRAM

ECS Meeting Abstracts, 2017
Spin-transfer torque [1] MRAM (STT-MRAM) continues to be the subject of intense investigation due to its scalability and excellent endurance. Initially explored mainly as a DRAM replacement, STT-MRAM with perpendicularly magnetized materials is now targeted as a nonvolatile memory, medium-performance replacement for mobile applications, and more long
E. J. O'Sullivan   +14 more
openaire   +1 more source

Reliability of Industrial grade Embedded-STT-MRAM

2020 IEEE International Reliability Physics Symposium (IRPS), 2020
Robust reliability of industrial grade (Tj: -40~125°C) was successfully demonstrated. The reliability items such as HTOL, retention and endurance test showed negligible fail bit count changes with ECC off mode even after accelerated stress conditions for 10yr user life time and come to zero with ECC on mode.
Yongsung Ji   +30 more
openaire   +2 more sources

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