Results 221 to 230 of about 1,564 (279)

Combinatorial Screening for Europium Induced Defect Engineering in Titania Anodic Memristors

open access: yesAdvanced Materials Interfaces, EarlyView.
A Ti‐Eu thin‐film combinatorial libary (3‐17 at.% Eu) was fabricated by co‐sputtering and anodisation. Systematic screening revealed forming‐free memristors with analog switching, with compositions between 7‐17 at.% Eu showing improved endurance and multilevel resistive states.
Elena Atanasova   +5 more
wiley   +1 more source

Highly selective cannibalism in the Late Pleistocene of Northern Europe reveals Neandertals were targeted prey. [PDF]

open access: yesSci Rep
Cosnefroy Q   +10 more
europepmc   +1 more source

Multimodal Imaging of Strain and Light Emission of Core–Shell InGaN/GaN Wires under a Sub‐Micrometer Polychromatic X‐Ray Probe

open access: yesAdvanced Materials Interfaces, EarlyView.
Micro‐Laue diffraction and excited optical X‐ray luminescence are used to study InGaN/GaN core‐shell wires on the BM32 beamline at the European Synchrotron. Multimodal imaging of X‐ray fluorescence, deviatoric strain tensors and optical emissions is performed using simultaneous mapping.
Beatriz de Goes Foschiani   +5 more
wiley   +1 more source

Soft Electromagnetic Actuator and Oscillator

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
This work presents a groundbreaking soft electromagnetic system capable of bistable actuation and self‐regulated oscillation. Using liquid metal and silicone as a compliant conductor, the actuator enables force generation, sensing, and feedback with minimal power.
Noah D. Kohls, Yi Chen Mazumdar
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

open access: yesAdvanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz   +5 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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