Results 41 to 50 of about 103,452 (148)

Highly Selective Wet Etching of Ge Over Ge_1- <i>_x</i> Sn _<i>x</i> Enabling Fully Released Group IV Microstructures. [PDF]

ACS Omega
Ayinde S, Myronov M.
europepmc   +1 more source

Blue Lasing at Room Temperature Based on a Quasi-Bound State in the Continuum. [PDF]

Nano Lett
Fąs T, Pruszyńska-Karbownik E, Sawicka M, Yavorskiy D, Feduniewicz A, Gołyga O, Słowikowski M, Kacperski J, Siekacz M, Muzioł G, Nowicki P, Kazakov A, Wróbel J, Czyszanowski T, Suffczyński J.   +14 more
europepmc   +1 more source

Etching characteristics and profile simulation of silicon. [PDF]

PLoS One
Zhang H, Cai P.
europepmc   +1 more source

Influence of masking layer stress on anisotropic silicon etching in TMAH solutions

, 2003
Nowadays MEMS device fabrication requires an accurate knowledge of the silicon etching parameters. We studied the relation between thin film masking layers residual stress and the orientation dependence of the silicon etching rate using TMAH solutions.
Guarnieri, Vittorio, Zen, Mario, Margesin, Benno, Ramjay Pal, Giacomozzi, Flavio, Decarli, Massimiliano   +5 more
core  

Stress-induced ripping enables fabrication of nanopores with dimensions smaller than the resolution limit of the employed lithography. [PDF]

Sci Adv
Liu X, De Ferrari F, Khabarov K, Formoso MB, Jain S, Herland A, Stemme G, De Angelis F, Niklaus F.   +8 more
europepmc   +1 more source

Characterization of TMAH Silicon Etchant Using Ammomium Persulfate as an Oxidizing Agent

, 1998
Among the silicon anisotropic etchants, tetramethyl ammonium hydroxide [TMAH] is of great interest due to the absence of metal ions. Therefore using TMAH solutions at low concentrations has the advantage of being more economical, both in terms of cost ...
Guarnieri, Vittorio, Zen, Mario, Giacomozzi, Flavio, Sebastiano Brida, M. Paranjape   +4 more
core  

Wafer-Level Self-Assembly and Interface Passivation Patterning Technology for Nanomaterial-Compatible 3D MEMS Sensing Chips. [PDF]

Nanomicro Lett
Zhang Z, Zhang Y, Luo Y, Lv G, Yin J, Tan P, Duan G.   +6 more
europepmc   +1 more source

TMAH Based High Speed Silicon Bulk Micromachining for MEMS

, 2019
Various process steps such as oxidation, diffusion, etching, lithography, etc. are employed for the fabrication of microstructures used in microelectromechanical systems (MEMS).
Veerla, Swarnalatha, Pal, Prem
core  

Advances in Morphology Control of Through-Glass via Wet Etching for High-Performance Glass-Based Packaging. [PDF]

Micromachines (Basel)
Zhang Q, Liu H.
europepmc   +1 more source

Suspended Germanium-on-Silicon Photonic Integrated Circuits Operating in the Long-Wave Infrared and Their Use for Ethanol Sensing. [PDF]

ACS Photonics
Lin PS, Hellström PE, Zervos C, Niklaus F, Gylfason KB.   +4 more
europepmc   +1 more source