Results 21 to 30 of about 103,452 (148)
Composition Control in CuInZnS2 Nanocrystals by Cation Exchange and Their Phase Transfer
This work elucidates the composition‐defining parameters for CuInZnS2 (CIZS) nanocrystals (NCs) prepared by a cation exchange reaction. Investigations focus on their cation shares and size, which influence both the absorbance and the bandgap. Furthermore, a novel ligand exchange route from 1‐dodecanthiol to 11‐mercaptoundecanoic acid is shown, thereby ...
Pia J. Thomsen +3 more
wiley +1 more source
ICP Etching of Silicon for Micro and Nanoscale Devices [PDF]
The physical structuring of silicon is one of the cornerstones of modern microelectronics and integrated circuits. Typical structuring of silicon requires generating a plasma to chemically or physically etch silicon.
Henry, Michael David
core +1 more source
Epitaxial growth forms III–V membranes directly atop the silicon waveguide layer on SOI, while in‐plane in situ doping defines lateral p–i–n InP/InGaAs junctions in a single growth step. The membrane photodetectors achieve 50 Gb/s NRZ‐OOK operation.
Zhao Yan +10 more
wiley +1 more source
A Four‐Terminal TiO2−x Memristor Architecture Enabling Multidimensional Associative Learning
This work demonstrates bidirectional Pavlovian conditioning in a single four‐terminal TiO2−x memristor device where two‐dimensional oxygen vacancy control and non‐filamentary resistive switching are realized. Extending this approach, multiple memristors arranged in an array autonomously perform multidimensional associative learning of two‐dimensional ...
Ryohei Yamamoto +4 more
wiley +1 more source
This study demonstrates a self‐assembly process to generate free‐standing piezoelectric nanomembranes, forming ultracompact microtubular acoustic wave sensors and actuators. The miniaturized 3D piezoelectric platform reported in this work can be applied in telecommunication, energy harvesting, and acoustofluidics. Moreover, the 3D self‐assembly can add
Raphaël C. L‐M. Doineau +9 more
wiley +1 more source
Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching [PDF]
The present research report a fabrication process of suspended silicon microstructures of desired thickness over controlled depth micromachined cavities.
Kazuo Sato +3 more
core +1 more source
Plasma‐induced ligand polymerization on colloidal quantum dots (QDs) renders them resistant to organic solvents, enabling conventional photoresist‐based photolithography. This approach achieves microscale patterning with feature sizes down to 3 µm, preserving the optical properties of the QDs and offering a simple and scalable route for QD‐based ...
Boram Kim, Jaehyeon Kim, Heeyeop Chae
wiley +1 more source
Review of Amorphous Gallium Oxide: From Material Synthesis to Device Applications
Amorphous gallium oxide (a‐Ga2O3) is reviewed as a promising ultra‐wide‐bandgap material for solar‐blind UV photodetectors. The influence of structural disorder, defect states, and trap‐assisted transport on optical and electronic performance is examined.
Alfred Moore +4 more
wiley +1 more source
Fabrication of recessed-gate AlGaN/GaN MOSFETs using TMAH wet etching with Cu ion implantation
In this study, recessed-gate AlGaN/GaN MOSFETs were fabricated using a novel recess etching method––TMAH wet etching with Cu ion implantation. This innovative approach injects Cu ions selectively into the target AlGaN layer, creating defects that are ...
In Man Kang +5 more
core +1 more source
Undercutting is a common problem in wet anisotropic etching. This problem in turn, influences the performance and sensitivity of MEMS devices. This paper investigates the use of corner compensation to prevent convex corner undercutting in a MEMS ...
Norliana, Yusof +2 more
core +4 more sources

