Results 21 to 30 of about 3,921 (200)

Two-step Fabrication of Large Area SiO2/Si Membranes

open access: yesMedžiagotyra, 2012
Two-step fabrication technique of SiO2/Si membrane combining the deep local etching of double side polished and thermally oxidized silicon <100> wafer in tetramethylammonium hydroxide (TMAH) water solution and SF6/O2 reactive ion etching is ...
Viktoras GRIGALIŪNAS   +7 more
doaj   +1 more source

Effect of tetramethylammonium hydroxide/isopropyl alcohol wet etching on geometry and surface roughness of silicon nanowires fabricated by AFM lithography

open access: yesBeilstein Journal of Nanotechnology, 2016
The optimization of etchant parameters in wet etching plays an important role in the fabrication of semiconductor devices. Wet etching of tetramethylammonium hydroxide (TMAH)/isopropyl alcohol (IPA) on silicon nanowires fabricated by AFM lithography is ...
Siti Noorhaniah Yusoh   +1 more
doaj   +1 more source

Enhanced Light Extraction of Flip-Chip Mini-LEDs with Prism-Structured Sidewall

open access: yesNanomaterials, 2019
Current solutions for improving the light extraction efficiency of flip-chip light-emitting diodes (LEDs) mainly focus on relieving the total internal reflection at sapphire/air interface, but such methods hardly affect the epilayer mode photons.
Bin Tang   +6 more
doaj   +1 more source

Optimization of Mesa Etch for a Quasi-Vertical GaN Schottky Barrier Diode (SBD) by Inductively Coupled Plasma (ICP) and Device Characteristics

open access: yesNanomaterials, 2020
The optimization of mesa etch for a quasi-vertical gallium nitride (GaN) Schottky barrier diode (SBD) by inductively coupled plasma (ICP) etching was comprehensively investigated in this work, including selection of the etching mask, ICP power, radio ...
Yue Sun   +7 more
doaj   +1 more source

3D surface topography and reflectivity of anisotropic etched silicon micromirrors for BioMEMS [PDF]

open access: yes, 2011
This paper examines wet and dry fabrication of vertical micro-mirrors in (110) silicon for use in an innovative BioMEMS integrating gripping and micro force sensing functionalities.
Le, HR, Lionis, N, Mackay, RE
core   +2 more sources

Micromachined two dimensional resistor arrays for determination of gas parameters [PDF]

open access: yes, 2003
A resistive sensor array is presented for two dimensional temperature distribution measurements in a micromachined flow channel. This allows simultaneous measurement of flow velocity and fluid parameters, like thermal conductivity, diffusion coefficient ...
Dijkstra, Marcel   +7 more
core   +2 more sources

TMAH/IPA anisotropic etching characteristics

open access: yesSensors and Actuators A: Physical, 1993
The main advantages of tetramethyl ammonium hydroxide (TMAH)-based solutions is their full compatibility with IC technologies. In this work a new etching system of TMAH/IPA (isopropyl alcohol) is suggested. The influence of the addition of IPA to TMAH solutions on their etching characteristics is presented.
Merlos Domingo, Ángel   +4 more
openaire   +2 more sources

Curvature-Modulated Si Spherical Cap-Like Structure Fabricated by Multistep Ring Edge Etching

open access: yesMicromachines, 2020
To create approximately spherical structures with curved sidewalls, this paper presents a method for building a series of decreasing slopes along the sidewall of a circular truncated cone.
Tieying Ma, Jiachen Wang, Dabo Li
doaj   +1 more source

Tetramethylammonium hydroxide (TMAH) treatment of dry-etched trenches on (010) β-Ga2O3 to enhance trench profiles [PDF]

open access: yesAIP Advances
We demonstrated heated tetramethylammonium hydroxide (TMAH) etching (25 wt. % concentration, at 90 °C) as an effective post-dry-etch treatment for improving dry-etched trench profiles on (010) β-Ga2O3. This treatment successfully converted rough, tapered
Takayoshi Oshima
doaj   +1 more source

PDMS residues-free micro/macrostructures on flexible substrates [PDF]

open access: yes, 2015
Transfer printing has been reported recently as a viable route for electronics on flexible substrates. The method involves transferring micro-/macrostructures such as wires or ultra-thin chips from Si (silicon) wafers to the flexible substrates by using ...
Dahiya, Ravinder   +2 more
core   +1 more source

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