Results 91 to 100 of about 341 (156)

Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB). [PDF]

Materials (Basel)
Han SE, Choi DG, Han S, Lee TY, Han DG, Lee HJ, Yoo S.   +6 more
europepmc   +1 more source

Progress in Research on Co-Packaged Optics. [PDF]

Micromachines (Basel)
Tian W, Hou H, Dang H, Cao X, Li D, Chen S, Ma B.   +6 more
europepmc   +1 more source

Recent Advances in Precision Diamond Wheel Dicing Technology. [PDF]

Micromachines (Basel)
Chen F, Du M, Feng M, Bao R, Jing L, Hong Q, Xiao L, Liu J.   +7 more
europepmc   +1 more source

Simulation Study on the Effect of Growth Pressure on Growth Rate of GaN. [PDF]

Materials (Basel)
Qin T, Yu H, Liu Q, Li Q, Wang Z, Wang S, Wang L, Wang G, Yu J, Qi Z, Yang Z, Zhang L.   +11 more
europepmc   +1 more source

Si Characterization on Thinning and Singulation Processes for 2.5/3D HBM Package Integration. [PDF]

Materials (Basel)
Choi M, Kim S, Noh T, Kang D, Jung S.
europepmc   +1 more source

Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology. [PDF]

Sensors (Basel)
Du J, Zhao X, Su J, Li B, Duan X, Dong T, Lin H, Ren Y, Miao Y, Radamson HH.   +9 more
europepmc   +1 more source

A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging. [PDF]

Fundam Res
Cheng L, Chen Z, Yu D, Pan D.
europepmc   +1 more source