Results 81 to 90 of about 341 (156)

Reflow solder flux residue and humidity interaction: investigation using real PCBA component designs. [PDF]

Sci Rep
Lakkaraju AR, Conseil-Gudla H, Bixenman M, Ambat R.   +3 more
europepmc   +1 more source

Phase Measuring Deflectometry for Wafer Thin-Film Stress Mapping. [PDF]

Sensors (Basel)
Gao Y, Wan X, Hsin K, Tao J, Yin Z, Yang F.   +5 more
europepmc   +1 more source

Heteroepitaxial 3C-SiC for MEMS Applications. [PDF]

Micromachines (Basel)
Garofalo A, Muoio A, Belsito L, Sapienza S, Ferri M, Roncaglia A, La Via F.   +6 more
europepmc   +1 more source

Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review. [PDF]

Micromachines (Basel)
Wang Y, Liu H, Huo L, Li H, Tian W, Ji H, Chen S.   +6 more
europepmc   +1 more source

Thermal management of 3-D heterogeneously integrated microelectronics: challenges and future research directions. [PDF]

Commun Eng
Sharma MK, Ramos-Alvarado B.
europepmc   +1 more source

Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging. [PDF]

ACS Omega
Noh T, Noh EC, Sung M, Yoon J, Seong HK, Kang DG, Yoon JW, Jung SB.   +7 more
europepmc   +1 more source

Near-field terahertz time-domain spectroscopy for in-line electrical metrology of semiconductor integration processes for memory. [PDF]

Commun Eng
Jun S, Baek I, Park S, Choi EH, Yoon J, Jeon I, Jang Y, Priwisch M, Kim W, Kim S, Kim T, Jo T, Lee M, Ryu S, Koo N, Yang Y.   +15 more
europepmc   +1 more source

Machine Learning-Based Soft Sensor for Real-Time Wire Bow Prediction in Diamond Multi-Wire Sawing. [PDF]

Sensors (Basel)
Zhao X, Liu H, Yang J, Zhu L, Li H, Qiu L, Zhang S.   +6 more
europepmc   +1 more source

Challenges and prospects for advanced packaging. [PDF]

Fundam Res
Chen Z, Zhang J, Wang S, Wong CP.
europepmc   +1 more source

<i>In Situ</i> Atomic-Scale Investigation of Electromigration Behavior in Cu-Cu Joints at High Current Density. [PDF]

ACS Nano
Huang HJ, Wang CH, Wang CH, Shen FC, Yang SC, Ong JJ, Chiu WL, Chang HH, Chen C, Wu WW.   +9 more
europepmc   +1 more source