Results 71 to 80 of about 341 (156)

Stepped-Tube Backside Cavity Piezoelectric Ultrasound Transducer Based on Sc_0.2AI_0.8N Thin Films. [PDF]

Micromachines (Basel), 2023
Li X, Lyu H, Safari A, Zhang S.
europepmc   +1 more source

Rapid and High-Fidelity Fabrication of Embedded Elastomeric Photomask for Wafer-Scale Sub-Micrometer Conformal Contact Photolithography. [PDF]

Micromachines (Basel)
Liang H, Lei B, Shu Z, Chen L, Duan H.
europepmc   +1 more source

Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions. [PDF]

Microsyst Nanoeng
Tang F, He S, Li Y, Liu W, Dong F, Liu S.   +5 more
europepmc   +1 more source

The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging. [PDF]

Micromachines (Basel)
Li D, Li B, Han S, Li D, Yang B, Gong B, Zhang Z, Yu C, Chen P.   +8 more
europepmc   +1 more source

750 V Breakdown in GaN Buffer on 200 mm SOI Substrates Using Reverse-Stepped Superlattice Layers. [PDF]

Micromachines (Basel)
You S, Lei Y, Wang L, Chen X, Zhou T, Wang Y, Wang J, Liu T, Li X, Zhao S, Zhang J, Hao Y.   +11 more
europepmc   +1 more source

A review of glass thermal reflow: method, device, and applications. [PDF]

Microsyst Nanoeng
Zhu M, Shi P, Zhang G, Yan C, Chen F, Liu S, Lian R, Zhu K, Dai H, Wu H, Liu Y, Li B, Du X, Xue G.   +13 more
europepmc   +1 more source

Thickness-dependent structural evolution of a-C:H layers formed by one-step Ar/CH₄ plasma reduction for direct Cu bonding. [PDF]

Sci Rep
Lee H, Kim SE.
europepmc   +1 more source

Study on Stress Distribution and Its Impact on Reliability of SiO₂-Based Inorganic Chiplet Gap Filling. [PDF]

Micromachines (Basel)
Ding Z, Liu S, Lin C, Zheng T, Xu L, Hu Q, Shi T, Li L.   +7 more
europepmc   +1 more source

Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging. [PDF]

Polymers (Basel)
Wu J, Chen F, Liu J, Chen R, Liu P, Zhao H, Zhao Z.   +6 more
europepmc   +1 more source

Heterogeneous Integration Technology Drives the Evolution of Co-Packaged Optics. [PDF]

Micromachines (Basel)
Gao H, Yan W, Zhang D, Yu D.
europepmc   +1 more source