Results 51 to 60 of about 341 (156)

Residual stress and deformation analysis considering adhesive material properties to enhance manufacturing of HBM

Journal of Materials Research and Technology
Residual stress and deformation in dies and wafers pose significant challenges in high-bandwidth memory (HBM) manufacturing. Precise die alignment is critical for multi-stacked dies in HBM packages, which utilize ultra-fine pitch interconnections.
Jaejin Jeon, Jeonghoon Song, Jun Young Oh, Seok Hwan Lee, Younghun Kim, Yun Ho Kim, Sam-Jong Choi, Sang Won Yoon   +7 more
doaj   +1 more source

Recent Advances in Nitride‐Based Micro‐LEDs for Next‐Generation Display

Advanced Physics Research, Volume 4, Issue 6, June 2025.
Nitride‐based Micro‐light‐emitting diode (Micro‐LED) is now spreading into the field of display technology, which has been dominated by liquid crystal display (LCD) and organic LED (OLED). This review focuses on recent developments in Micro‐LED display, including epitaxy and chip processing, mass transfer, driving, bonding, and detection technologies ...
Jiahao Song, Jingjing Jiang, Minhua Li, Qianxi Zhou, Linyue Meng, Ke Sun, Siyuan Cui, Kuosheng Wen, Sheng Liu, Shengjun Zhou   +9 more
wiley   +1 more source

Thermal Residual Stress Analysis of Soldering and Lamination Processes for Fabrication of Crystalline Silicon Photovoltaic Modules

Energies, 2018
In this study, we developed a finite element model to assess the residual stress in the soldering and lamination processes during the fabrication of crystalline silicon (Si) photovoltaic (PV) modules.
Hyunseong Shin, Ekyu Han, Nochang Park, Donghwan Kim   +3 more
doaj   +1 more source

Nonlinear Variation Decomposition of Neural Networks for Holistic Semiconductor Process Monitoring

Advanced Intelligent Systems, Volume 6, Issue 10, October 2024.
The nonlinear variation decomposition is proposed to decompose output variations from neural network inputs and to evaluate the influence of unit processes in each sample from semiconductor manufacturing. Herein, industrial 1Y nm node dynamic random‐access memory test vehicles with baseline and split tests introducing high‐k metal gates with a minimum ...
Hyeok Yun, Hyundong Jang, Seunghwan Lee, Junjong Lee, Kyeongrae Cho, Seungjoon Eom, Soomin Kim, Choong‐Ki Kim, Hong‐Chul Byun, Seongjoo Han, Min‐Soo Yoo, Rock‐Hyun Baek   +11 more
wiley   +1 more source

Exploring Conductive Filler‐Embedded Polymer Nanocomposite for Electrical Percolation via Electromagnetic Shielding‐Based Additive Manufacturing

Advanced Materials Technologies, Volume 9, Issue 17, September 4, 2024.
This review investigates composite materials and their electrical conductivity via conductive fillers and percolation thresholds. It examines the role of nanoparticles in polymer‐based nanocomposites. Additionally, it discusses the impact of additive manufacturing on industries like automotive and aerospace, filler alignment, and the potential of ...
Nilam Qureshi, Vivek Dhand, Shaik Subhani, Rajendran Senthil Kumar, Nagarajan Raghavan, Sanghoon Kim, Jaehyeok Doh   +6 more
wiley   +1 more source

From Rigid to Flexible: Progress, Challenges and Prospects of Thin c‐Si Solar Energy Devices

Advanced Energy Materials, Volume 14, Issue 27, July 19, 2024.
This review comprehensively explores recent advancements in thin c‐Si solar energy devices, including techniques for producing thin films, advanced light trapping methods, surface passivation strategies, and thin wafer management approaches. It also explores the wide‐ranging applications of thin c‐Si solar cells and sheds light on the techno‐economic ...
Bikesh Gupta, Kwan Hong Min, Yonghwan Lee, Julie Tournet, Bram Hoex, Chennupati Jagadish, Hark Hoe Tan, Siva Karuturi   +7 more
wiley   +1 more source

Mechanism of Grain Densification in Nano- and Poly-Crystalline Cu Films and Its Impact in Advanced Metallization Processes

Crystals
We investigate the microstructural evolution of electrochemically deposited poly-crystalline Cu films during subsequent thermal process cycles at mild maximum temperatures, compatible with the integration in advanced metallization schemes for electronic ...
Brunella Cafra, Alessandra Alberti, Gaetano Calogero, Ioannis Deretzis, Antonio Landi, Daniele Pagano, Salvatore Sanzaro, Antonino La Magna   +7 more
doaj   +1 more source

Robust and Seamless Integration of Thiol‐Ene‐Epoxy Thermosets with Thermoplastics and Glass as Hybrid Microfluidic Devices Suitable for Drug Studies

Advanced Materials Interfaces, Volume 11, Issue 14, May 16, 2024.
Integration of off‐stoichiometry thiol‐ene‐epoxy (OSTE+) thermosets to glass and thermoplastic materials via direct (pristine) and indirect (primed) bonding to form hybrid microfluidic devices that exhibit various levels of bonding strength. Primer coating, in general, enhances the bonding robustness.
Peter Harris, Javad Kaveh, Aurino M. Kemas, Henrik Mikaelsson, Matthew Fielden, Volker M. Lauschke, Reza Zandi Shafagh   +6 more
wiley   +1 more source

Interfacial delamination on fan-out wafer-level package using finite element analysis

Results in Engineering
Fan-out wafer-level packaging has become a widely known approach for achieving a microelectronic device with low cost, smaller package size, and good electrical performance.
Ariel P. Conversion, Aristotle T. Ubando, Jeremias A. Gonzaga   +2 more
doaj   +1 more source

Effect of Annealing Time of GaN Buffer Layer on Curvature and Wavelength Uniformity of Epitaxial Wafer

Condensed Matter
In this study, the curvature changes of an unintentionally doped GaN end and third quantum well were observed in situ when the annealing times of a GaN buffer layer were 40 s, 50 s and 55 s, respectively.
Huanyou Wang, Guangqi Xie, Yingying Zhan
doaj   +1 more source