Results 31 to 40 of about 341 (156)

Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies

Frontiers in Electronics
Wafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical interconnections through its efficient and highly reliable manufacturing ...
Pallavi Praful, Chris Bailey
doaj   +1 more source

Stress control in trench field-plate power MOSFETs and its impact on on-resistance reduction

Power Electronic Devices and Components
The limitations regarding lateral cell pitch narrowing and on-resistance reduction were investigated. Trench field plate MOSFETs feature deep trenches with thick oxide films.
Hiroaki Kato, Shin-ichi Nishizawa, Wataru Saito   +2 more
doaj   +1 more source

Method for distortion correction of multi-layered surface reconstruction using time-gated wavefront sensing approach [PDF]

Journal of the European Optical Society-Rapid Publications, 2013
In order to estimate the multi-layer surface profile and to detect the inter-layer surfaces defects, gated wavefront sensing approach has been proposed in the previous works [1, 2].
Tan C. S., Wang X., Ng Y. H., Lim W. K., Chai T. Y.   +4 more
doaj   +1 more source

Conductive Bonding and System Architectures for High‐Performance Flexible Electronics

Advanced Functional Materials, Volume 36, Issue 33, 23 April 2026.
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley   +1 more source

Single crystalline silicon solar cells with rib structure

AIP Advances, 2017
To improve the conversion efficiency of Si solar cells, we have developed a thin Si wafer-based solar cell that uses a rib structure. The open-circuit voltage of a solar cell is known to increase with deceasing wafer thickness if the cell is adequately ...
Shuhei Yoshiba, Masakazu Hirai, Yusuke Abe, Makoto Konagai, Yukimi Ichikawa   +4 more
doaj   +1 more source

Thermal Stress in Multilayered Flexible Solar Cell Circuit With Different Temperatures

Engineering Reports, Volume 8, Issue 4, April 2026.
This study employs a coupled thermal‐mechanical analysis approach to simulate the deformation behavior of flexible thin‐film solar cell circuits under varying temperature conditions. Stress analysis demonstrates a significant temperature‐induced stress redistribution. Copper bears the maximum thermal stress under low‐temperature conditions.
Chunhao Shi, Zhichao Huang, Tianhao Yu, Yang Gao, Min Wu, Min Qian, Enjie Zhang, Yabin Yan   +7 more
wiley   +1 more source

Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process

Journal of Microelectronics and Electronic Packaging, 2021
Abstract At present, the general fan-out package generally uses the molding process and uses epoxy molding compound (EMC) material to complete the reconstruction of wafer, but it is not friendly to small-size chips and high fan-out ratio packaging types. In order to solve the problem of small size and high fan-out ratio and other fan-out
Hu Zhen, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, Kim Hwee Tan   +6 more
openaire   +1 more source

Process-Induced Warpage Behavior in Backside Power Delivery Network Fabrication

IEEE Journal of the Electron Devices Society
As semiconductor devices continue to scale, backside power delivery networks (BSPDNs) have emerged as a promising alternative to conventional front-side power delivery networks (FSPDNs), offering improved routing flexibility and power integrity. However,
Seong-Ji Min, Haeyong Park, Hyeong-Kyu Jin, Won-Chan Kim, Eun-Young Park, Sang-Pill Kim, Jun-Hyeok Lee, Sung Kyu Lim, Hyun-Yong Yu   +8 more
doaj   +1 more source

Theoretical studies of silicon hetero-junction solar cells with rib structure

AIP Advances, 2019
The open-circuit voltage of a solar cell is known to increase with deceasing wafer thickness if the cell is adequately passivated. However, it is not easy to handle very thin wafers because they are brittle and are subject to warpage.
Yukimi Ichikawa, Yoshiaki Osawa, Hiroshi Noge, Makoto Konagai   +3 more
doaj   +1 more source

Universal Solvent Escape Strategies for Efficient Curing of Hydrogen‐Bond‐Rich 3D Printing Inks

Advanced Science, Volume 13, Issue 12, 27 February 2026.
This study developed a new 3D printing method for hydrogen‐bonded polymers by combining solvent replacement, nanoparticles, and optimized printing paths. This allows fast, precise scaffold fabrication. The scaffolds can be easily customized and release therapeutic agents slowly through protonation, enabling personalized bone, blood vessel, and nerve ...
Jie Chen, Qing Zhao, Wentao Fu, Weixian Chen, Xiaoqian Zhang, Gaiying Ye, Qinglei Meng, Liyuan Shao, Qian Ma, Lin Zhao, Ying Zhao, Weihua Guo   +11 more
wiley   +1 more source