Results 21 to 30 of about 341 (156)

Slicing of 4H‐SiC Wafers Combining Ultrafast Laser Irradiation and Bandgap‐Selective Photo‐Electrochemical Exfoliation

Advanced Materials Interfaces, Volume 10, Issue 21, July 26, 2023., 2023
The slicing of 4H silicon carbide (4H‐SiC) wafers is realized by combining femtosecond laser irradiation and bandgap‐selective photo‐electrochemical (PEC) exfoliation. Femtosecond‐laser irradiation leads to the formation of a damage layer consisting of amorphous silicon and amorphous carbon.
Wenhao Geng, Qinqin Shao, Yan Pei, Lingbo Xu, Can Cui, Xiaodong Pi, Deren Yang, Rong Wang   +7 more
wiley   +1 more source

Evaluation of Warpage and Residual Stress of Precision Glass Micro-Optics Heated by Carbide-Bonded Graphene Coating in Hot Embossing Process

Nanomaterials, 2021
A newly developed hot embossing technique which uses the localized rapid heating of a thin carbide-bonded graphene (CBG) coating, greatly reduces the energy consumption and promotes the fabrication efficiency.
Lihua Li, Jian Zhou
doaj   +1 more source

Dual Coil Patterned Ultra‐Thin Silicon Film Enable by Double‐Sided Process

Advanced Materials Interfaces, Volume 10, Issue 16, June 6, 2023., 2023
Double‐sided processing on ultra‐thin silicon provides the opportunity to double the number of devices or create dual functionalities. As a demonstration, a dual coil patterned ultra‐thin silicon (DCUTS) is fabricated. DCUTS is then demonstrated as an actuating, energy harvesting, and vibrating mirror system.
ChangHee Son, Sangyeop Lee, Placid M. Ferreira, Seok Kim   +3 more
wiley   +1 more source

High-temperature 3D printing of polyetheretherketone products: Perspective on industrial manufacturing applications of super engineering plastics

Materials & Design, 2021
A refined additive manufacturing system of material extrusion type was developed considering the high-temperature conditions of extruder and chamber.
Seong Je Park, Ji Eun Lee, Jiyong Park, Nak-Kyu Lee, Yong Son, Suk-Hee Park   +5 more
doaj   +1 more source

Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures

Nanomaterials, 2019
Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules.
Shuping Xie, Xinjun Wan, Bo Yang, Wei Zhang, Xiaoxiao Wei, Songlin Zhuang   +5 more
doaj   +1 more source

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application

Nanomaterials, 2023
Advanced packaging technology has become more and more important in the semiconductor industry because of the benefits of higher I/O density compared to conventional soldering technology.
Yuan-Chiu Huang, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, Kuan-Neng Chen   +4 more
doaj   +1 more source

Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal

Applied Sciences
During the diamond wire saw cutting process of sapphire crystals, warpage is one of the key parameters for evaluating wafer quality. Based on the thermoelasticity theory and diamond wire saw cutting theory, a finite element model for thermal analysis of ...
Yihe Liu, Dameng Cheng, Guanzheng Li, Yufei Gao   +3 more
doaj   +1 more source

Warpage Measurement of Thin Wafers by Reflectometry

Physics Procedia, 2011
AbstractTo cope with advances in the electronic and portable devices, electronic packaging industries have employed thinner and larger wafers to produce thinner packages/ electronic devices. As the thickness of the wafer decrease (below 250um), there is an increased tendency for it to warp.
Ng, CHI SENG, Asundi, ANAND KRISHNA
openaire   +1 more source

Stress Analysis of the Interface Reaction Layer Between Ni–P Films and GaAs Substrate After Annealing

Electrochemistry
Electroless Ni–P plating films, used as the seed layers for the backside electrodes of gallium arsenide (GaAs) semiconductor devices, cause substrate warping (wafer warpage) during annealing, leading to substrate cracking and chipping.
Koichiro NISHIZAWA, Ayumu MATSUMOTO, Yasuyuki NAKAGAWA, Hitoshi SAKUMA, Yoshiki KOJIMA, Naoki FUKUMURO, Shinji YAE   +6 more
doaj   +1 more source

Electric-driven flexible-roller nanoimprint lithography on the stress-sensitive warped wafer

International Journal of Extreme Manufacturing, 2023
Surface nanopatterning of semiconductor optoelectronic devices is a powerful way to improve their quality and performance. However, photoelectric devices’ inherent stress sensitivity and inevitable warpage pose a huge challenge on fabricating ...
Yu Fan, Chunhui Wang, Jiaxing Sun, Xiaogang Peng, Hongmiao Tian, Xiangming Li, Xiaoliang Chen, Xiaoming Chen, Jinyou Shao   +8 more
doaj   +1 more source