Results 221 to 230 of about 18,989 (261)
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Mechanical interactions and their effects on chemical mechanical polishing
IEEE Transactions on Semiconductor Manufacturing, 2001Mechanical interactions, such as contact stress and fluid pressure are of extreme importance in silicon wafer polishing, especially for the wafer-scale planarity of the finished surfaces. In this paper, the measurements of interfacial fluid pressure and friction, as well as their dependence on some major process variables, are presented.
null Lei Shan +2 more
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Silicon Nitride Chemical Mechanical Polishing Mechanisms
Journal of The Electrochemical Society, 1998To elucidate the fundamentals of chemical mechanical polishing (CMP) of silicon nitride, low pressure chemical vapor deposited silicon nitride is analyzed by X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy both before and after CMP, demonstrating the salient increase of oxygen content, amine species, and silanol groups ...
Y. Z. Hu, R. J. Gutmann, T. P. Chow
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Tribological behavior of 6H–SiC wafers in different chemical mechanical polishing slurries
Wear, 2021Qixiang Zhang, Jisheng Pan, Jiabin Lu
exaly
Study on chemical mechanical polishing of silicon wafer with megasonic vibration assisted
Ultrasonics, 2017Ke Zhai, Liang Li
exaly
Chemical Mechanical Polishing of Ta
Electrochemical and Solid-State Letters, 1999openaire +1 more source
Chemical mechanical polishing of titanium
Abstracts of the General Sessions of the Japanese Society for Dental Materials and Devices, 2002Okawa, S. +6 more
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