Results 11 to 20 of about 537,942 (300)
An Extended CMOS ISFET Model Incorporating the Physical Design Geometry and the Effects on Performance and Offset Variation [PDF]
17/04/13 meb. Accepted version OK to pub.This paper presents an extended model for the CMOS-based Ion-Sensitive-Field-Effect-Transistor (ISFET), incorporating design parameters associated with the physical geometry of the device.
Liu, Y +14 more
core +1 more source
A Review on Passive and Integrated Near-Field Microwave Biosensors
In this paper we review the advancement of passive and integrated microwave biosensors. The interaction of microwave with biological material is discussed in this paper.
Subhajit Guha +2 more
doaj +1 more source
Design of a single-chip pH sensor using a conventional 0.6-μm CMOS process [PDF]
A pH sensor fabricated on a single chip by an unmodified, commercial 0.6-/spl μm CMOS process is presented. The sensor comprises a circuit for making differential measurements between an ion-sensitive field-effect transistor (ISFET) and a reference ...
Ali, D. +8 more
core +2 more sources
We present the fabrication and characterization of a suspended microbridge resonator with an embedded nanochannel. The suspended microbridge resonator is electrostatically actuated, capacitively sensed, and monolithically integrated with complementary ...
Gabriel Vidal-Álvarez +3 more
doaj +1 more source
In this paper, a predictive model is developed to characterize the impact of high-frequency electromagnetic interference (EMI) on the leakage current of CMOS integrated circuits.
Zahra Abedi +4 more
doaj +1 more source
Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems
This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensorsystems that have been developed to monitor the motion and vital signs of humans invarious ...
Makoto Ishida +3 more
doaj +1 more source
Design and Fabrication of Vertically-Integrated CMOS Image Sensors
Technologies to fabricate integrated circuits (IC) with 3D structures are an emerging trend in IC design. They are based on vertical stacking of active components to form heterogeneous microsystems.
Orit Skorka, Dileepan Joseph
doaj +1 more source
Radiation Effects in Pinned Photodiode CMOS Image Sensors: Pixel Performance Degradation Due to Total Ionizing Dose [PDF]
Several Pinned Photodiode (PPD) CMOS Image Sensors (CIS) are designed, manufactured, characterized and exposed biased to ionizing radiation up to 10 kGy(SiO2 ).
Goiffon, Vincent +20 more
core +1 more source
Implementation of a CMOS/MEMS Accelerometer with ASIC Processes
This paper presents the design, simulation and mechanical characterization of a newly proposed complementary metal-oxide semiconductor (CMOS)/micro-electromechanical system (MEMS) accelerometer. The monolithic CMOS/MEMS accelerometer was fabricated using
Yu-Sian Liu, Kuei-Ann Wen
doaj +1 more source
A novel CMOS hexaferrite circulator with 25 GHz operating frequency
A novel CMOS hexaferrite circulator with a Y-junction structure is designed and fabricated, which is compatible with standard CMOS technology. The spin-coating approach is adopted during the fabrication, in which the photoresist is mixed with nano ...
Guangjun Zhang, Yanfeng Jiang
doaj +1 more source

