Results 141 to 150 of about 392,135 (196)
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A 125-KHZ CMOS-MEMS Resoswitch Embedded Zero Quiescent Power OOK/FSK Receiver
IEEE/LEOS International Conference on Optical MEMS, 2020This paper demonstrates a 125-kHz micromechanical resoswitch-embedded zero quiescent power OOK/FSK communication receiver based on a CMOS-MEMS fabrication platform for low-frequency (LF) active RFID standby receiver applications. In particular, differing
Chun-Pu Tsai, Y-Y Liao, Wei-Chang Li
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Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design - ICCAD '06, 2006
CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing.
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CMOS-MEMS integration can improve the performance of the MEMS (micro-electromechanical systems), allows for smaller packages and leads to a lower packaging and instrumentation cost. As argued in this article, processing MEMS above CMOS is the most promising approach for CMOS-MEMS integration, but it limits the thermal budget for MEMS processing.
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2014 IEEE International Frequency Control Symposium (FCS), 2014
To greatly enhance the performance of our previously developed CMOS-MEMS resonant gate field effect transistor (RGFET) [1], a novel CMOS-MEMS RGFET array which combines a metal/oxide composite resonant-gate arrayed structure and a FET arrayed transducer has been proposed for the first time utilizing the TSMC 0.35 μm CMOS technology together with a ...
Chi-Hang Chin, Sheng-Shian Li
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To greatly enhance the performance of our previously developed CMOS-MEMS resonant gate field effect transistor (RGFET) [1], a novel CMOS-MEMS RGFET array which combines a metal/oxide composite resonant-gate arrayed structure and a FET arrayed transducer has been proposed for the first time utilizing the TSMC 0.35 μm CMOS technology together with a ...
Chi-Hang Chin, Sheng-Shian Li
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IEEE Sensors Journal, 2020
In this paper, a thin film based Thermoresistive Micro Calorimetric Flow (TMCF) sensor by using a $0.35~\mu \text{m}$ 2P4M CMOS MEMS technology is designed, fabricated and tested.
W. Xu, Xiaoyi Wang, Y. Chiu, Yi-Kuen Lee
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In this paper, a thin film based Thermoresistive Micro Calorimetric Flow (TMCF) sensor by using a $0.35~\mu \text{m}$ 2P4M CMOS MEMS technology is designed, fabricated and tested.
W. Xu, Xiaoyi Wang, Y. Chiu, Yi-Kuen Lee
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Two-Dimensional CMOS MEMS Thermal Flow Sensor With High Sensitivity and Improved Accuracy
Journal of microelectromechanical systems, 2020In this paper, we report a two-dimensional (2D) Thermoresistive Micro Calorimetric Flow (TMCF) sensor by using a $0.35~\mu \text{m}$ 2P4M CMOS MEMS technology. For the airflow, the fabricated and the open-space packaged 2D flow sensor system achieved the
W. Xu +4 more
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An Integrated CMOS Mems Gas Flow Sensor with Detection Limit Towards Micrometer Per Second
IEEE/LEOS International Conference on Optical MEMS, 2020We report an integrated Thermoresistive Micro Calorimetric Flow (TMCF) sensor with the detection limit towards $\mu\mathrm{m}/\mathrm{s}$ level by using proprietary InvenSense CMOS MEMS technology. The TMCF sensor shows a prominent normalized sensitivity
W. Xu +4 more
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Proceedings of IEEE Sensors, 2003
The gyroscope reported in this paper is a lateral-axis angular rate sensor with in-plane vibration and out-of-plane Coriolis acceleration sensing. The sensor plus on-chip CMOS circuitry is about 1 mm by 1 mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask(s) and a single-crystal ...
null Huikai Xie, G.K. Fedder
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The gyroscope reported in this paper is a lateral-axis angular rate sensor with in-plane vibration and out-of-plane Coriolis acceleration sensing. The sensor plus on-chip CMOS circuitry is about 1 mm by 1 mm in size and is fabricated by a post-CMOS micromachining process that uses interconnect metal layers as etching mask(s) and a single-crystal ...
null Huikai Xie, G.K. Fedder
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Journal of Micromechanics and Microengineering, 2019
This study presents the micro thermoelectric infrared (IR) sensor consisting of the heat transduction absorber and the serpentine structure with embedded thermocouple using the TSMC 0.18 µm 1P6M standard CMOS process and the in-house post-CMOS MEMS ...
Ting-Wei Shen +3 more
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This study presents the micro thermoelectric infrared (IR) sensor consisting of the heat transduction absorber and the serpentine structure with embedded thermocouple using the TSMC 0.18 µm 1P6M standard CMOS process and the in-house post-CMOS MEMS ...
Ting-Wei Shen +3 more
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CMOS MEMS - present and future
Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266), 2003The paper reviews the state-of-the-art in the field of CMOS-based microelectromechanical systems (MEMS). The different CMOS MEMS fabrication approaches, pre-CMOS, intermediate-CMOS, and post-CMOS, are summarized and examples are given. Two microsystems fabricated with post-CMOS micromachining are presented, namely a mass-sensitive chemical sensor for ...
H. Baltes +4 more
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