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Effect of different dentin etching protocols on the immediate microtensile bond strength of two bulk-fill restorative systems in class I cavities. [PDF]

BMC Oral Health
Albelasy EH, Raghip AG, Ismail HS.
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Ultrahigh Resolution Titanium Deep Reactive Ion Etching

ACS Applied Materials & Interfaces, 2017
Titanium (Ti) represents a promising new material for microelectromechanical systems (MEMS) because of its unique properties. Recently, this has been made possible with the advent of processes that enable deep reactive ion etching (DRIE) of high-aspect-ratio (HAR) structures in bulk Ti substrates.
Bryan W K Woo, Rao Masaru P
exaly   +3 more sources

Deep reactive ion etching as a tool for nanostructure fabrication

Journal of Vacuum Science & Technology B, 2009
Deep reactive ion etching (DRIE) is investigated as a tool for the realization of nanostructures and architectures, including nanopillars, silicon nanowires or carbon nanotubes on Si nanopillars, nanowalls, and nanonetworks. The potential of combining top-down fabrication methods with the bottom-up synthesis of one-dimensional nanocomponents is ...
Richard Yong Qing Fu, Andrea C Ferrari, Milne W I   +2 more
exaly   +2 more sources

Reactive ion etching and deep reactive ion etching processes

2nd International Conference on Mechanical, Electronics, and Electrical and Automation Control (METMS 2022), 2022
YiHan WU, HaiLin He
exaly   +2 more sources

Process characterisation of deep reactive ion etching for microfluidic application

International Journal of Nanotechnology, 2018
The goal of this paper is to investigate the influence of parameters of the Bosch deep reactive ion etching (DRIE) process on etched surface profile, sidewall profile and etch rate of micrometre silicon features. By investigating these parameters, we found the conditions to obtain smooth sidewall, high etch rate and balance of chemical and physical ...
Chien Mau Dang, Dung My Thi Dang
exaly   +2 more sources

Wafer Bevel Protection During Deep Reactive Ion Etching

IEEE Transactions on Semiconductor Manufacturing, 2011
During deep reactive ion etching of silicon used for through silicon via or deep trench isolation processing, the bevel of the wafer is also etched away. The etching of the bevel results in a deep step at the litho edge bead removal or in a degraded bevel shape, source of yield loss or processing issues.
Efrain Altamirano-Sanchez, Jaume Roig
exaly   +2 more sources

Superhydrophobic surfaces by dynamic nanomasking and deep reactive ion etching

Proceedings of the Institution of Mechanical Engineers, Part N: Journal of Nanoengineering and Nanosystems, 2007
This paper reports a study on fabricating superhydrophobic surfaces with micro- and nanohierarchical topography by dynamic nanomasking (DNM) and deep reactive ion etching (DRIE). In this study, thin layers of gold (Au) were sputtered on silicon (Si) wafers followed by annealing the samples in a conventional furnace to break the ...
Min Zou
exaly   +2 more sources

Deep reactive ion etching of PMMA

Applied Surface Science, 2004
Abstract The deep reactive ion etching of PMMA in O 2 , O 2 /CHF 3 discharges has been examined as a function of plasma parameters such as pressure, power and relative composition. It is demonstrated that the etching rate initially increases with pressure but decreases after 6.65 Pa.
Congchun Zhang, Chunsheng Yang, Duifu Ding   +2 more
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Deep Reactive Ion Etching of Silicon

MRS Proceedings, 1998
AbstractThe ability to etch deep trenches in silicon while controlling not only the profile of etched features but also the etching rate, uniformity and selectivity enable us to expand the number and scope of MEMS devices. In fact, the increase of MEMS applications in different and varied fields requiring deep silicon etching or high aspect ratio ...
A. A. Ayón, K.-S Chen, K. A. Lohner, S. M. Spearing, H. H. Sawin, M. A. Schmidt   +5 more
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Milestones in deep reactive ion etching

The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05., 2005
Deep reactive ion etching (DRIE) has virtually changed MEMS. The basic technology originally developed at Bosch overcomes design restrictions and compatibility problems related to the old wet-etching technology. Today, after a decade of "Bosch DRIE" in the field, a large variety of new MEMS devices is fabricated using this technology, and a broad DRIE ...
F. Laermer, A. Urban
openaire   +1 more source