Results 111 to 120 of about 8,725 (286)

Double‐Transition‐Metal MXenes: Multimetallic 2D Platforms for Next‐Generation Biomedicine

open access: yesAdvanced Materials, EarlyView.
The present work explores recent progress in double‐transition‐metal MXenes and focuses on their potential as multifunctional biomedical nanoplatforms whose tunable optical, electronic, mechanical, and surface properties enable imaging, theranostics, antimicrobial activity, biosensing, tissue engineering, and drug delivery.
Parsa Namakiaraghi   +2 more
wiley   +1 more source

Microfabrication of high-temperature silicon devices using wafer bonding and deep reactive ion etching,

open access: yes, 1999
Index Terms-Aligned fusion bonding, combustor efficiency, deep reactive ion etching, fuel injector, fuel manifold, gas turbine engine, hydrogen-air combustion, microcombustor, micro heat engine, silicon creep, silicon oxidation, turbine inlet ...
Ian A Waitz   +3 more
core  

Fabrication of novel MEMS microgrippers by deep reactive ion etching with metal hard mask

open access: yes, 2017
The fabrication of a novel class of microgrippers is demonstrated by means of bulk microelectromechanical systems (MEMS) technology using silicon on insulator wafer substrates and deep reactive ion etching.
Ronchin, Sabina   +11 more
core   +1 more source

Advancing Lithium–Oxygen Batteries: Pioneering Cathode Catalyst Innovation and Artificial Intelligence‐Driven Design Paradigms

open access: yesAdvanced Materials, EarlyView.
This review summarizes the principles and challenges of nonaqueous lithium‐oxygen batteries and recent advances in cathode catalysts, including carbon‐based materials, metals, oxides, sulfides, nitrides, carbides, and redox mediators. It highlights emerging design strategies and artificial intelligence‐driven approaches, emphasizing data‐assisted ...
Yuqing Yao   +8 more
wiley   +1 more source

Development and characterization of deep reactive ion etching technology for through silicon interconnection

open access: yes, 2010
Deep reactive ion etching (DRIE) is an enabling technology for three dimensional (3D) integration of planar integrated circuits. This work focuses on various challenges associated with deep reactive ion etching technology for realizing through silicon ...
Nagarajan, Ranganathan
core   +1 more source

Indium‐Mediated Glue‐Like Interlayer Enables Stable High‐Capacity Flexible Sodium Metal Batteries

open access: yesAdvanced Materials, EarlyView.
A three‐dimensional Na‐In‐S/Cu composite interlayer is constructed on a flexible current collector via an In‐mediated in situ reaction. Featuring abundant Na nucleation sites and a low diffusion barrier, this interlayer enables rapid and uniform Na deposition.
Xinyan Li   +13 more
wiley   +1 more source

Reactive ion etching of 4H-SiC using SF6/O2 for MEMS application [PDF]

open access: yes, 2013
Deep Reactive Ion Etching (DRIE) of 4H-SiC performed using SF6/O2 plasma. The etching rates investigated as a function of the ratio of the O2 flow rate to total gas flow rate under different etching conditions such as the effect of power density ...
Hamidon, Mohd Nizar   +1 more
core  

Reactive ion etching (CF4+O2 plasma) induced deep levels in metal–oxide–semiconductor devices

open access: yes, 1992
A reduction in device dimensions requires more accurate etching procedures. Reactive ion etching (RIE) provides many of the needed improvements. The energetic ions and photons produced by the glow discharge plasma of RIE, individually or in combination ...
Misra, D., D. Misra
core   +1 more source

Ultrathin Li Metal Anodes: Quantitative Design Principles and Manufacturability Across Liquid and Solid‐State Batteries

open access: yesAdvanced Materials, EarlyView.
Ultrathin lithium metal anodes (≤15 µm) offer a promising route to high‐energy‐density batteries due to their high capacity and low potential. This review presents design principles for ultrathin Li, evaluates fabrication strategies, and discusses challenges in liquid and solid‐state cells.
Cheng Wang   +9 more
wiley   +1 more source

Profile Control of a Borosilicate-Glass Groove Formed by Deep Reactive Ion Etching [PDF]

open access: yes, 2007
Deep reactive ion etching (DRIE) of borosilicate glass and profile control of an etched groove are reported. DRIE was carried out using an anodically bonded silicon wafer as an etching mask. We controlled the groove profile, namely improving its sidewall
Akashi, T., Yoshimura, Y.
core  

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