Results 131 to 140 of about 8,725 (286)

Enhanced Vertical Sidewall Quality for Functional AlN Films in 3D Piezo MEMS Applications

Advanced Electronic Materials
Integrating piezoelectric materials onto the vertical surfaces of microelectromechanical systems (MEMS) microstructures enables three‐dimensional piezoelectric (3D piezoMEMS) devices, providing multi‐axis sensing and actuation capabilities with a reduced
Arsam Ali, Glenn Ross, Mervi Paulasto‐Kröckel   +2 more
doaj   +1 more source

Advances in Halide Perovskites for Photon Radiation Detectors

Advanced Materials Technologies, EarlyView.
This work highlights recent progress in perovskite‐based photon radiation detectors, covering organic–inorganic hybrid, inorganic, lead‐free double, and vacancy‐ordered halide perovskites. Their detection performance is compared, material‐specific advantages and challenges are examined, and provides insight into current limitations and future ...
Liangling Wang, Jieqi Wang, Xiaojun Cui, Carsten Ronning   +3 more
wiley   +1 more source

Formation of Silicon Nanopores and Nanopillars by a Maskless Deep Reactive Ion Etching Process

, 2007
This paper presents a maskless process to create silicon nanopores and nanopillars by inductively coupled plasma deep reactive ion etching (ICP DRIE).
Zhiyong Xiao, Philip C.H. Chan, Hsing, I. Ming, Chan, Philip C.H., Feng, Chunhua, Chunhua Feng, I-Ming Hsing, Xiao, Zhiyong   +7 more
core   +1 more source

Spin‐On SiOx‐Assisted Inkjet Printing for Interdigitated n+ and p+ Poly‐Si/SiOx Contacts in Silicon Solar Cells With Suppressed Unintended Doping

Advanced Materials Technologies, EarlyView.
This work presents an innovative spin‐on SiOx‐assisted inkjet‐printed approach to form localized n+ and p+ poly‐Si/SiOx passivating contacts for high‐efficiency silicon solar cells within a single‐annealing step. The developed process results in a well‐defined interdigitated doping pattern, with unintended doping and cross‐doping concentrations ...
Jiali Wang, Jinlei Ren, Laura Creon, Paula Peres, Rene Chemnitzer, Pierre‐Yves Corre, Sieu Pheng Phang, Daniel Macdonald, AnYao Liu   +8 more
wiley   +1 more source

Die Separation Strength for Deep Reactive Ion Etched Wafers

Typical micro-scale devices made via cleanroom processes are often produced in bulk quantities on a single wafer. Depending on the lateral dimensions of a device, as many as a few hundred can be manufactured on an individual wafer. With expensive required facilities and raw materials, industrial manufacturing of siliconbased electrical and MEMS devices
D. A. Porter, T. A. Berfield
openaire   +2 more sources

End‐to‐End Sensing Systems for Breast Cancer: From Wearables for Early Detection to Lab‐Based Diagnosis Chips

Advanced Materials Technologies, EarlyView.
This review explores advances in wearable and lab‐on‐chip technologies for breast cancer detection. Covering tactile, thermal, ultrasound, microwave, electrical impedance tomography, electrochemical, microelectromechanical, and optical systems, it highlights innovations in flexible electronics, nanomaterials, and machine learning.
Neshika Wijewardhane, Lyn I. Jones, Richard M. Martin, Helen Winter, Faezeh Arab Hassani   +4 more
wiley   +1 more source

Large‐Scale and Cost‐Effective Fabrication of Ultra‐Thin, Biodegradable Microelectrode Arrays and Pressure Sensors Using Laser Micromachining

Advanced Materials Technologies, EarlyView.
A mask‐free and cost‐effective UV‐pico‐second laser‐based microfabrication method is proposed to fabricate large‐area biodegradable microelectrode arrays and pressure sensors. These devices demonstrate low impedance, good conformability, excellent biocompatibility, and rapid degradation, providing a new route for next‐generation transient electronics ...
Bhavani Prasad Yalagala, Asfand Tanwear, María Cerezo‐Sánchez, Hossein Parvizi, Morteza Amjadi, Hadi Heidari   +5 more
wiley   +1 more source

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

Advanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu, Mengyao Xiao, Zhouli Sui, Yinpeng Wang, Daoye Zheng, Yuxin Liu, Luwei Wang, Huajun Liu, Chengkuo Lee   +8 more
wiley   +1 more source

Fabrication of sharp silicon hollow microneedles by deep-reactive ion etching towards minimally invasive diagnostics. [PDF]

Microsyst Nanoeng, 2019
Li Y, Zhang H, Yang R, Laffitte Y, Schmill U, Hu W, Kaddoura M, Blondeel EJM, Cui B.   +8 more
europepmc   +1 more source

Graphene‐Interfaced Stretchable Sweat Patch for Multiplexed Electrochemical Monitoring of IL‐6, Glucose, and Calcium Ions

Advanced Materials Technologies, EarlyView.
Flexible sweat sensor patch integrating graphene‑interfaced gold microelectrodes functionalized with bio‑receptors and ion‑selective membrane, coupled with a capillary‑driven microfluidic layer and portable potentiostat electronics for multiplexed monitoring of inflammatory, metabolic, and electrolyte biomarkers in microliter sweat volumes.
Roomia Memon, Ali Tufani, Süleyman Çelik, Javed H. Niazi, Anjum Qureshi   +4 more
wiley   +1 more source