Results 21 to 30 of about 53,870 (328)

Deep reactive ion etching of silicon carbide [PDF]

open access: yesJournal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2001
In this article, we describe more than 100-μm-deep reactive ion etching (RIE) of silicon carbide (SiC) in oxygen-added sulfur hexafluoride (SF6) plasma. We used a homemade magnetically enhanced, inductively coupled plasma reactive ion etcher (ME-ICP-RIE) and electroplated nickel masks. First, 5 h etching experiments using etching gases with 0%, 5%, 10%
Tanaka, S, Rajanna, K, Abe, T, Esashi, M
openaire   +2 more sources

Plasma removal of Parylene C [PDF]

open access: yes, 2008
Parylene C, an emerging material in microelectromechanical systems, is of particular interest in biomedical and lab-on-a-chip applications where stable, chemically inert surfaces are desired.
Li, Po-Ying, Meng, Ellis, Tai, Yu-Chong
core   +1 more source

The Improvement of Performance through Minimizing Scallop Size in MEMS Based Micro Wind Turbine

open access: yesMicromachines, 2021
In this paper we report on the improvement of performance by minimizing scallop size through deep reactive-ion etching (DRIE) of rotors in micro-wind turbines based on micro-electro-mechanical systems (MEMS) technology.
Young Chan Choi   +3 more
doaj   +1 more source

Thermally assisted ion beam etching of polytetrafluoroethylene, a new technique for high aspect ratio etching of MEMS [PDF]

open access: yes, 1996
In micromechanics, the etching of high aspect ratio structures in polymers is a prime technology. Normally, oxygen-based reactive ion etching or the LIGA technique are used to achieve this goal.
Berenschot, Erwin   +4 more
core   +3 more sources

In vivo measurements with robust silicon-based multielectrode arrays with extreme shaft lengths [PDF]

open access: yes, 2013
In this paper, manufacturing and in vivo testing of extreme-long Si-based neural microelectrode arrays are presented. Probes with different shaft lengths (15–70 mm) are formed by deep reactive ion etching and have been equipped with platinum electrodes ...
Baracskay, Péter   +7 more
core   +1 more source

Carrier lifetimes in gold–hyperdoped silicon—Influence of dopant incorporation methods and concentration profiles

open access: yesAPL Materials, 2022
Incorporating ultrahigh concentrations of deep-level dopants in silicon drastically alters silicon’s optoelectronic properties. Photodiodes built from silicon hyperdoped with gold extend light sensitivity into the shortwave infrared region, far beyond ...
Sashini Senali Dissanayake   +10 more
doaj   +1 more source

New Fabrication Method of Silicon Sub-Micron Beams with Monolithic Contacts for Thermoelectric Transport Properties Analysis

open access: yesNanomaterials, 2022
Micromachined devices were developed and fabricated using complementary metal-oxide-semiconductor (CMOS)/micro-electro-mechanical systems (MEMS) technology allowing for the analysis of transport properties of silicon sub-micron beams having monolithic ...
Andrej Stranz   +2 more
doaj   +1 more source

Two-step Fabrication of Large Area SiO2/Si Membranes

open access: yesMedžiagotyra, 2012
Two-step fabrication technique of SiO2/Si membrane combining the deep local etching of double side polished and thermally oxidized silicon <100> wafer in tetramethylammonium hydroxide (TMAH) water solution and SF6/O2 reactive ion etching is ...
Viktoras GRIGALIŪNAS   +7 more
doaj   +1 more source

Deep reactive ion etching of ‘grass-free’ widely-spaced periodic 2D arrays, using sacrificial structures

open access: yes, 2020
We fabricated two-dimensional arrays of periodic, widely-spaced pillars using deep reactive ion etching of silicon. To avoid the formation of micro-grass in the large open areas we used sacrificial structures surrounding the widely-spaced pillars.
Chantal M. Silvestre   +3 more
semanticscholar   +1 more source

Fabrication of photonic band-gap crystals [PDF]

open access: yes, 1995
We describe the fabrication of three-dimensional photonic crystals using a reproducible and reliable procedure consisting of electron beam lithography followed by a sequence of dry etching steps.
Cheng, C. C., Scherer, A.
core   +1 more source

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