Results 41 to 50 of about 53,870 (328)

Thermal scanning probe lithography using Parylene C as thermal resist

Micro & Nano Letters, 2022
Thermal scanning probe lithography is a direct‐write patterning method that uses a heated scanning probe tip to remove thermal resist. The most widely used thermal resist is polyphthalaldehyde. Another alternative thermal resist, Parylene C is introduced
Yun Jiang, Kevin Dodds, Camelia Dunare, Peter Lomax, Rebecca Cheung   +4 more
doaj   +1 more source

High-Q trenched aluminum coplanar resonators with an ultrasonic edge microcutting for superconducting quantum devices

Scientific Reports, 2023
Dielectric losses are one of the key factors limiting the coherence of superconducting qubits. The impact of materials and fabrication steps on dielectric losses can be evaluated using coplanar waveguide (CPW) microwave resonators.
E. V. Zikiy, A. I. Ivanov, N. S. Smirnov, D. O. Moskalev, V. I. Polozov, A. R. Matanin, E. I. Malevannaya, V. V. Echeistov, T. G. Konstantinova, I. A. Rodionov   +9 more
doaj   +1 more source

Lithographic band gap tuning in photonic band gap crystals [PDF]

, 1996
We describe the lithographic control over the spectral response of three-dimensional photonic crystals. By precise microfabrication of the geometry using a reproducible and reliable procedure consisting of electron beam lithography followed by dry ...
Arbet-Engels, V., Cheng, C. C., Scherer, A., Yablonovitch, E.   +3 more
core   +1 more source

Deep-reactive ion etching of silicon nanowire arrays at cryogenic temperatures

Applied Physics Reviews
The pursuit of sculpting materials at increasingly smaller and deeper scales remains a persistent subject in the field of micro- and nanofabrication. Anisotropic deep-reactive ion etching of silicon at cryogenic temperatures (cryo-DRIE) was investigated ...
Jiushuai Xu, A. D. Refino, A. Delvallée, Sebastian Seibert, Christian Schwalb, Poul-Erik Hansen, M. Foldyna, L. Šiaudinytė, G. Hamdana, H. S. Wasisto, J. Kottmeier, Andreas Dietzel, Thomas Weimann, Jan K. Prüßing, H. Bracht, Erwin Peiner   +15 more
semanticscholar   +1 more source

The Influence of Etching Method on the Occurrence of Defect Levels in III-V and II-VI Materials

Nanomaterials
The influence of the etching method on the occurrence of defect levels in InAs/InAsSb type-II superlattice (T2SLs) and MCT photodiode is presented. For both analyzed detectors, the etching process was performed by two methods: wet chemical etching and ...
Kinga Majkowycz, Krzysztof Murawski, Małgorzata Kopytko, Krzesimir Nowakowski-Szkudlarek, Marta Witkowska-Baran, Piotr Martyniuk   +5 more
doaj   +1 more source

Hybrid lithography based fabrication of 3D patterns by deep reactive ion etching

Microelectronic Engineering, 2019
Electron-beam lithography (EBL) possesses tremendous capabilities in terms of patterning ultra-small features, with very low line edge roughness and high overlay accuracy.
L. Jenni, L. Kumar, C. Hierold
semanticscholar   +1 more source

Micromachining of buried micro channels in silicon [PDF]

, 2000
A new method for the fabrication of micro structures for fluidic applications, such as channels, cavities, and connector holes in the bulk of silicon wafers, called buried channel technology (BCT), is presented in this paper.
Berenschot, J.W. (Erwin), Berg, Albert van den, Boer, Meint J. de, Burger, G.J., Elwenspoek, Miko, Gardeniers, J.G.E. (Han), Jansen, Henri V., Tjerkstra, R. Willem   +7 more
core   +3 more sources

Single crystal diamond micro-disk resonators by focused ion beam milling

APL Photonics, 2018
We report on single crystal diamond micro-disk resonators fabricated in bulk chemical vapor deposition diamond plates (3 mm × 3 mm × 0.15 mm) using a combination of deep reactive ion etching and Focused Ion Beam (FIB) milling.
Teodoro Graziosi, Sichen Mi, Marcell Kiss, Niels Quack   +3 more
doaj   +1 more source

Wafer-bonded deep fluidics in BCB with in-plane coupling for lab-on-a-chip applications

Micro and Nano Engineering, 2023
The wafer-scale fabrication of deep channel microfluidics for lab-on-a-chip applications by reactive ion etching and wafer bonding is reported. The microfluidic channels are etched in B-stage bisbenzocyclobutene (BCB) and Cytop with the latter used as a ...
Deepthi Sekhar, Ewa Lisicka-Skrzek, Pierre Berini   +2 more
doaj   +1 more source

Microfabrication of large-area circular high-stress silicon nitride membranes for optomechanical applications

AIP Advances, 2016
In view of the integration of membrane resonators with more complex MEMS structures, we developed a general fabrication procedure for circular shape SiNx membranes using Deep Reactive Ion Etching (DRIE).
E. Serra, M. Bawaj, A. Borrielli, G. Di Giuseppe, S. Forte, N. Kralj, N. Malossi, L. Marconi, F. Marin, F. Marino, B. Morana, R. Natali, G. Pandraud, A. Pontin, G. A. Prodi, M. Rossi, P. M. Sarro, D. Vitali, M. Bonaldi   +18 more
doaj   +1 more source