Results 51 to 60 of about 53,870 (328)

Metal mask free dry-etching process for integrated optical devices applying highly photostabilized resist. [PDF]

, 2006
Photostabilization is a widely used post lithographic resist treatment process, which allows to harden the resist profile in order to maintain critical dimensions and to increase selectivity in subsequent process steps such as reactive ion etching.
Driessen, A., Sengo, G., Wolferen, H., Wörhoff, K.   +3 more
core   +1 more source

Effect of Laser Deoxidation on Adhesive‐Bonded Aluminum in an Oxygen‐Free Atmosphere

Advanced Engineering Materials, EarlyView.
This study investigates laser ablation of aluminum under oxygen‐free conditions. The goal is to produce oxide‐free substrates that enable improved adhesive bonding with epoxy. Optimized laser parameters (90% overlap, 300 µJ) combined with oxide‐free substrates result in the highest tensile strength of the adhesive bond.
Sandra Gerland, Finn‐Lennard Janthur, Sarah Seffer, Jörg Hermsdorf, Ludger Overmeyer, Annika Raatz   +5 more
wiley   +1 more source

Mask material effects in cryogenic deep reactive ion etching [PDF]

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena, 2007
Cryogenic silicon etching in inductively coupled SF6∕O2 plasma has been studied, especially the behavior of mask materials. Suitability of eight different mask materials for cryogenic silicon deep reactive ion etching has been investigated. Three of the five photoresists suffered from cracking during cryogenic etching.
Franssila, Sami, Sainiemi, Lauri
openaire   +2 more sources

Anisotropic Etching of Graphite and Graphene in a Remote Hydrogen Plasma [PDF]

, 2017
We investigate the etching of a pure hydrogen plasma on graphite samples and graphene flakes on SiO$_2$ and hexagonal Boron-Nitride (hBN) substrates. The pressure and distance dependence of the graphite exposure experiments reveals the existence of two ...
Camenzind, Timothy N., Hug, Dorothee, Kalyoncu, Yemliha B., Marot, Laurent, Rehmann, Mirko K., Taniguchi, Takashi, Watanabe, Kenji, Zihlmann, Simon, Zumbühl, Dominik M.   +8 more
core   +2 more sources

Low‐Angle Grain Boundaries and Re‐Segregation in Single‐Crystalline Ni‐Base Superalloys

Advanced Engineering Materials, EarlyView.
This work demonstrates that Re‐segregation at low‐angle grain boundaries (LAGBs) in Ni‐base superalloys is influenced by misorientation angle. Advanced microscopy and atom probe tomography reveal that higher misorientation angles increases Re‐segregation.
Alireza B. Parsa, Aparna Saksena, Alesander Kostka, Pascal Thome, Felicitas Scholz, Alexandre Mussi, Christoph Somsen, Baptiste Gault, Jan Frenzel, Gunther Eggeler   +9 more
wiley   +1 more source

Biomass Native Structure Into Functional Carbon‐Based Catalysts for Fenton‐Like Reactions

Advanced Functional Materials, EarlyView.
This study indicates that eight biomasses with 2D flaky and 1D acicular structures influence surface O types, morphology, defects, N doping, sp2 C, and Co nanoparticles loading in three series of carbon, N‐doped carbon, and cobalt/graphitic carbon. This work identifies how these structural factors impact catalytic pathways, enhancing selective electron
Wenjie Tian, Jingkai Lin, Zhihao Tian, Selusiwe Ncube, Huayang Zhang, Emiliano Cortés, Hongqi Sun, Shaobin Wang   +7 more
wiley   +1 more source

An Investigation of Processes for Glass Micromachining

Micromachines, 2016
This paper presents processes for glass micromachining, including sandblast, wet etching, reactive ion etching (RIE), and glass reflow techniques.
Nguyen Van Toan, Masaya Toda, Takahito Ono   +2 more
doaj   +1 more source

A Method for Improving Heat Dissipation and Avoiding Charging Effects for Cavity Silicon-on-Glass Structures

Actuators, 2023
Anode bonding is a widely used method for fabricating devices with suspended structures, and this approach is often combined with deep reactive-ion etching (DRIE) for releasing the device; however, the DRIE process with a glass substrate can potentially ...
Junduo Wang, Yuwei Hu, Lei Qian, Yameng Shan, Wenjiang Shen   +4 more
doaj   +1 more source

Reactive ion etching of 4H-SiC using SF6/O2 for MEMS application [PDF]

, 2013
Deep Reactive Ion Etching (DRIE) of 4H-SiC performed using SF6/O2 plasma. The etching rates investigated as a function of the ratio of the O2 flow rate to total gas flow rate under different etching conditions such as the effect of power density ...
Hamidon, Mohd Nizar, Hezarjaribi, Yadollah   +1 more
core  

Holistic approach to dissolution kinetics : linking direction-specific microscopic fluxes, local mass transport effects and global macroscopic rates from gypsum etch pit analysis [PDF]

, 2013
Dissolution processes at single crystal surfaces often involve the initial formation and expansion of localized, characteristic (faceted) etch-pits at defects, in an otherwise comparatively unreactive surface.
Abendan, Alonso-Azcárate, Alonso-Azcárate, Arvidson, Bard, Binnig, Blum, Blum, Bosbach, Bosbach, Bosbach, Brantley, Brown, Buchanan, Burns, Burt, Cama, Cama, Chen, Chow, Chow, Christoffersen, Colombani, Colombani, Compton, Compton, Compton, Dove, Engstrom, Fan, Fleischmann, Ford, Forster, Fujiwara, Gasperino, Hall, Hartman, Heinze, Hong, Howell, Jeschke, Jeschke, Jones, Jones, Jordan, Kowacz, Lasaga, Lasaga, Levich, Liu, Lüttge, Lüttge, Lüttge, MacInnis, Macpherson, Macpherson, Macpherson, Macpherson, Martin A. Edwards, Massimo Peruffo, Mbogoro, McGeouch, McGeouch, Michael M. Mbogoro, Morel, Morse, Nancollas, Olhoeft, Orton, Pachon-Rodriguez, Patrick R. Unwin, Peltonen, Ruiz-Agudo, Ruiz-Agudo, Ruiz-Agudo, Sangwal, Schecher, Schofield, Singh, Stumm, Svensson, Tang, Tang, Tang, Taylor, Titiz-Sargut, Unwin, Unwin, Van Driessche, Van Rosmalen, Vanysek, Vavouraki, Wang, White, Wightman, Zhang   +95 more
core   +1 more source