Results 151 to 160 of about 6,778 (181)

Affordable method for channel geometry-specific flow control in microfluidics without commercial pumps. [PDF]

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Liu X   +7 more
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High-power optical microswitch fabricated by deep reactive ion etching (DRIE)

SPIE Proceedings, 2003
Development of a high power optical micro switch fabricated by deep reactive ion etching (DRIE) in silicon on insulator (SOI) substrates is presented. The devices discussed are a key component in a MEMS-based, Naval safety and arming (S&A) system for use in underwater weapons.
Kevin R. Cochran   +2 more
openaire   +1 more source

Uniformity-improving dummy structures for deep reactive ion etching (DRIE) processes

SPIE Proceedings, 2005
In typical DRIE processes, the etch rate variation across the wafer increases with pattern density, severely limiting the pattern densities that can be used at a specified etch rate tolerance. Here, we present a scheme for including uniformity-improving dummy structures in the etch mask layout that enable the use of high-density patterns in many DRIE ...
Soren Jensen   +3 more
openaire   +1 more source

Developing terahertz filters using the deep reactive ion etching (DRIE) process

2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), 2016
This paper introduces some recent developments of terahertz bandpass filters. By adopting dual-resonating-mode cavities, transmission zeroes are obtained in the design, which greatly improve the selectivity of the terahertz bandpass filters. As demonstrations, terahertz bandpass filters having a center frequency of 400 GHz have been fabricated by using
null Zhang-Cheng Hao, Wei Hong
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Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE)

MRS Proceedings, 2003
ABSTRACTWafer and die level uniformity effects in Deep Reactive Ion Etching (DRIE) are quantitatively modeled and characterized. A two-level etching model has been developed to predict non-uniformities in high-speed rotating microstructures. The separation of wafer level and die level effects is achieved by sequentially etching wafers with uniformly ...
Hongwei Sun   +3 more
openaire   +1 more source

AN ultra-low cost deep reactive ion etching (drie) tool for flexible, small volume manufacturing

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015
Our goal is to demonstrate that we can achieve a radical reduction in the capital cost of micro/nano-manufacturing without sacrificing performance by scaling production throughput. As a demonstration of this concept, we show for the first time a DRIE system that processes small substrates (∼1 in2) with performance comparable to commercial systems for a
P.A. Gould   +4 more
openaire   +1 more source

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